参数资料
型号: AGLN250V5-VQ100
厂商: Microsemi SoC
文件页数: 72/150页
文件大小: 0K
描述: IC FPGA NANO 1KB 250K 100VQFP
标准包装: 90
系列: IGLOO nano
逻辑元件/单元数: 6144
RAM 位总计: 36864
输入/输出数: 68
门数: 250000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -20°C ~ 70°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
IGLOO nano DC and Switching Characteristics
2-12
Revision 17
Power Calculation Methodology
This section describes a simplified method to estimate power consumption of an application. For more
accurate and detailed power estimations, use the SmartPower tool in Libero SoC software.
The power calculation methodology described below uses the following variables:
The number of PLLs as well as the number and the frequency of each output clock generated
The number of combinatorial and sequential cells used in the design
The internal clock frequencies
The number and the standard of I/O pins used in the design
The number of RAM blocks used in the design
Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 2-19 on
Enable rates of output buffers—guidelines are provided for typical applications in Table 2-20 on
Read rate and write rate to the memory—guidelines are provided for typical applications in
Table 2-20 on page 2-14. The calculation should be repeated for each clock domain defined in the
design.
Methodology
Total Power Consumption—PTOTAL
PTOTAL = PSTAT + PDYN
PSTAT is the total static power consumption.
PDYN is the total dynamic power consumption.
Total Static Power Consumption—PSTAT
PSTAT = (PDC1 or PDC2 or PDC3) + NBANKS * PDC5
NBANKS is the number of I/O banks powered in the design.
Total Dynamic Power Consumption—PDYN
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL
Global Clock Contribution—PCLOCK
PCLOCK = (PAC1 + NSPINE * PAC2 + NROW * PAC3 + NS-CELL* PAC4) * FCLK
NSPINE is the number of global spines used in the user design—guidelines are provided in
the "Spine Architecture" section of the IGLOO nano FPGA Fabric User's Guide.
NROW is the number of VersaTile rows used in the design—guidelines are provided in the
"Spine Architecture" section of the
FCLK is the global clock signal frequency.
NS-CELL is the number of VersaTiles used as sequential modules in the design.
PAC1, PAC2, PAC3, and PAC4 are device-dependent.
Sequential Cells Contribution—PS-CELL
PS-CELL = NS-CELL * (PAC5 + 1 / 2 * PAC6) * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design. When a
multi-tile sequential cell is used, it should be accounted for as 1.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-19 on
FCLK is the global clock signal frequency.
相关PDF资料
PDF描述
HMC44DRTS-S734 CONN EDGECARD 88POS DIP .100 SLD
AGLN250V5-ZVQ100 IC FPGA NANO 1KB 250K 100VQFP
AGLN250V5-ZVQG100 IC FPGA NANO 1KB 250K 100VQFP
HMC44DRES-S734 CONN EDGECARD 88POS .100 EYELET
EP1K10FC256-3N IC ACEX 1K FPGA 10K 256-FBGA
相关代理商/技术参数
参数描述
AGLN250V5-VQ100I 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN250V5-VQG100 功能描述:IC FPGA 250K 1.5V 100VTQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
AGLN250V5-VQG100I 功能描述:IC FPGA NANO 1KB 250K 100VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN250V5-ZCSG81 功能描述:IC FPGA NANO 1KB 250K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
AGLN250V5-ZCSG81I 功能描述:IC FPGA NANO 1KB 250K 81-CSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)