参数资料
| 型号： | AGLP030V5-CSG289I |
| 厂商： | Microsemi SoC |
| 文件页数： | 134/134页 |
| 文件大小： | 0K |
| 描述： | IC FPGA IGLOO PLUS 30K 289-CSP |
| 标准包装： | 152 |
| 系列： | IGLOO PLUS |
| 逻辑元件/单元数： | 792 |
| 输入/输出数： | 120 |
| 门数： | 30000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 289-TFBGA，CSBGA |
| 供应商设备封装： | 289-CSP（14x14） |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页当前第134页
IGLOO PLUS Low Power Flash FPGAs
Revision 16
3-5
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Related Documents
The following documents provide packaging information and device selection for low power flash
devices.
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
This document contains the package mechanical drawings for all packages currently or previously
supplied by Microsemi. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are available at
相关PDF资料 |
PDF描述 |
|---|---|
| M1A3P400-PQG208 | IC FPGA 1KB FLASH 400K 208-PQFP |
| M1A3P400-PQ208 | IC FPGA 1KB FLASH 400K 208-PQFP |
| GBB95DHBS | CONN EDGECARD 190PS R/A .050 SLD |
| GBB95DHAT | CONN EDGECARD 190PS R/A .050 SLD |
| ABM43DTMN | CONN EDGECARD 86POS R/A .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AGLP030-V5CSG289PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030-V5FCS289 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030V5-FCS289 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOO PLUS FAMILY 30K GATES 256 CELLS 130NM (CMOS) TECH - Trays |
| AGLP030-V5FCS289ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
| AGLP030-V5FCS289I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology |
发布紧急采购，3分钟左右您将得到回复。