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参数资料
| 型号： | AH1-1G |
| 元件分类： | 放大器 |
| 英文描述： | 250 MHz - 3000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | GREEN, TO-243C, SOT-89, 3 PIN |
| 文件页数： | 5/5页 |
| 文件大小： | 228K |
| 代理商： | AH1-1G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
x Phone 1-800-WJ1-4401 x FAX: 408-577-6621 x e-mail: sales@wj.com x Web site: www.wj.com
Page 5 of 5 April 2007
AH1-1
High Dynamic Range Amplifier
AH1-1G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
qC reflow temperature) and leaded
(maximum 245
qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
qC
Thermal Resistance, Rth
(1)
59
q C / W
Junction Temperature, Tjc
(2)
129
q C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85
qC case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
qC.
Product Marking
The AH1-1G will be marked with an
“AH1G” designator.
An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package. A “1” will be lasermarked in the
upper right-hand corner.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V to <2000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
q C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
M
T
F
(m
il
li
o
n
h
r
s
)
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