参数资料
型号: AH102
厂商: TRIQUINT SEMICONDUCTOR INC
元件分类: 放大器
英文描述: 350 MHz - 3000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封装: SURFACE MOUNT PACKAGE-3
文件页数: 4/4页
文件大小: 686K
代理商: AH102
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
September 2004
AH102
Medium Power, High Linearity Amplifier
Product Information
The Communications Edge
TM
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
° C
Thermal Resistance
1, Rth
25
° C / W
Junction Temperature
2, Tjc
130
° C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+9V, 200 mA at an 85
° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
° C.
Product Marking
The AH102 will be marked with an “AH102”
designator.
An alphanumeric lot code
(‘XXXX-X’) is also marked below the part
designator on the top surface of the package.
A “0” will be lasermarked in the upper right-
hand corner.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1C
Value:
Passes
≥ 1000V min.
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
≥ 1000V min.
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating
Value:
Level 3 at +235
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1.
A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2.
Ground / thermal vias are critical for the proper performance
of this device.
Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
3.
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4.
Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
5.
Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
All dimensions are in millimeters (inches). Angles are in
degrees.
MTTFvs. GNDTabTemperature
1
10
100
1000
60
70
80
90
100
110
120
TabTemperature (°C)
相关PDF资料
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