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参数资料
| 型号： | AH11 |
| 厂商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分类： | 放大器 |
| 英文描述： | 150 MHz - 3000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | PLASTIC, MS-012, SOIC-8 |
| 文件页数： | 5/7页 |
| 文件大小： | 490K |
| 代理商： | AH11 |
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
July 2005
AH11
High Dynamic Range Dual Amplifier
Product Information
The Communications Edge TM
AH11 (SOIC-8 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
q C
Thermal Resistance, Rth (1)
28
q C/W
Junction Temperature, Tjc (2)
127
q C
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab underneath the
device.
2. This corresponds to the typical biasing condition of
+5V, 300 mA at an 85 C case
temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 C.
Product Marking
The component will be marked with a “WJ
AH11” designator with an alphanumeric lot
code on the top surface of the package. Tape
and reel specification for this part is located on
the website in the “Application Notes” section.
ESD / MSL Information
ESD Rating:
Class 1B
Value:
Passes from 500 to 1000 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating:
Class IV
Value:
Passes greater than 1000 V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating:
Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Functional Pin Layout
Pin
Function
1
RF input (Amp1 input)
2
Ground
3
Ground
4
RF input (Amp2 input)
5
RF output (Amp2 output)
6
Ground
7
Ground
8
RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1.
Ground / thermal vias are critical for the proper performance
of this device.
2.
Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3.
To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a
heatsink.
Ensure that the ground / thermal via region
contacts the heatsink.
5.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
9.
A minimum of 12 ground vias are required for .014”
and .028” FR4 board.
MTTFvs. GNDTabTemperature
1
10
100
1000
60
70
80
90
100
110
TabTemperature(°C)
M
TT
F
(m
ill
io
n
hr
s)
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