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参数资料
| 型号： | AH1 |
| 厂商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分类： | 放大器 |
| 英文描述： | 250 MHz - 4000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | SOT-89, 3 PIN |
| 文件页数： | 5/5页 |
| 文件大小： | 189K |
| 代理商： | AH1 |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 5 of 5 July 2006
AH1
High Dynamic Range Amplifier
Product Information
The Communications Edge
TM
AH1-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260
°C reflow temperature) and leaded
(maximum 245
°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
°C
Thermal Resistance, Rth
(1)
59
°C / W
Junction Temperature, Tj
(2)
129
°C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85
°C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
°C.
Product Marking
The AH1-G will be marked with an “AH1G”
designator.
An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package.
The obsolete tin-lead package is marked with
an
“AH1”
designator
followed
by
an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V to <2000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260
°C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink.
Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
M
T
TF
(m
il
li
on
hr
s
)
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