参数资料
型号: AM29F200BB-90DTI1
厂商: ADVANCED MICRO DEVICES INC
元件分类: PROM
英文描述: 128K X 16 FLASH 5V PROM, 90 ns, UUC42
封装: SURF TAPE PACKAGE-42
文件页数: 8/10页
文件大小: 174K
代理商: AM29F200BB-90DTI1
Am29F200B Known Good Die
7
SU PP L E ME NT
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test flow. For more detailed information, refer to the
Am29F200B product qualification database supple-
ment for KGD. AMD implements quality assurance pro-
cedures throughout the product test flow. In addition,
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on Known
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
Figure 1.
AMD KGD Product Test Flow
Wafer Sort 1
Bake
24 hours at 250
°C
Wafer Sort 2
Wafer Sort 3
Hot Temperature
Packaging for Shipment
Shipment
DC Parameters
Functionality
Programmability
Erasability
Data Retention
DC Parameters
Functionality
Programmability
Erasability
DC Parameters
Functionality
Programmability
Erasability
Speed
Incoming Inspection
Wafer Saw
Die Separation
100% Visual Inspection
Die Pack
相关PDF资料
PDF描述
AM29F200BB-75DPC1 128K X 16 FLASH 5V PROM, 70 ns, UUC42
AM29F200T-90FD 256K X 8 FLASH 5V PROM, 90 ns, PDSO48
AM29F200T-150FE 256K X 8 FLASH 5V PROM, 150 ns, PDSO48
AM29F200B-150FC 256K X 8 FLASH 5V PROM, 150 ns, PDSO48
AM29F400BB-120ED Flash Memory IC; Leaded Process Compatible:Yes; Memory Size:4Mbit; Package/Case:48-TSOP; Peak Reflow Compatible (260 C):Yes; Supply Voltage Max:5V; Access Time, Tacc:120ns; Series:AM29 RoHS Compliant: Yes
相关代理商/技术参数
参数描述
AM29F200BB-90EC 制造商:Advanced Micro Devices 功能描述:
AM29F200BB-90EF 制造商:Advanced Micro Devices 功能描述:
AM29F200BB-90EI 制造商:Spansion 功能描述:2M CMOS FLASH 5V 制造商:Advanced Micro Devices 功能描述:
AM29F200BB-90SE 制造商:Spansion 功能描述:NOR Flash Parallel 5V 2Mbit 256K/128K x 8bit/16bit 90ns 44-Pin SOIC
AM29F200BT-120EI 制造商:Advanced Micro Devices 功能描述:256K X 8 FLASH 5V PROM, 120 ns, PDSO48