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参数资料
型号： Am29LV641DH101RZE
厂商： Advanced Micro Devices, Inc.
英文描述： 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI Control
中文描述： 64兆位（4个M x 16位），3.0伏的CMOS只均匀部门闪光控制记忆与VersatileI
文件页数： 4/57页
文件大小： 1467K
代理商： AM29LV641DH101RZE
September 20, 2002
Am29LV640D/Am29LV641D
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Special Handling Instructions for FBGA/
f
BGA Packages .........8
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Ordering Information . . . . . . . . . . . . . . . . . . . . . .10
Device Bus Operations . . . . . . . . . . . . . . . . . . . . .11
Table 1. Device Bus Operations .....................................................11
VersatileIO
(V
IO
) Control .....................................................11
Requirements for Reading Array Data ...................................11
Writing Commands/Command Sequences ............................12
Accelerated ProgramOperation ......................................................12
Autoselect Functions .......................................................................12
Standby Mode ........................................................................12
Automatic Sleep Mode ...........................................................12
RESET#: Hardware Reset Pin ...............................................12
Output Disable Mode ..............................................................13
Table 2. Sector Address Table ........................................................13
Autoselect Mode .....................................................................17
Table 3. Autoselect Codes, (High Voltage Method) .......................17
Sector Group Protection and Unprotection .............................18
Table 4. Sector Group Protection/Unprotection Address Table .....18
Write Protect (WP#) ................................................................19
Temporary Sector Group Unprotect .......................................19
Figure 1. Temporary Sector Group UnprotectOperation................ 19
Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 20
SecSi (Secured Silicon) Sector Flash MemoryRegion ..........21
Table 5. SecSi Sector Contents ......................................................21
Hardware Data Protection ......................................................21
Low VCC Write Inhibit .....................................................................21
Write Pulse “Glitch” Protection ........................................................22
Logical Inhibit ..................................................................................22
Power-Up Write Inhibit ....................................................................22
Common Flash Memory Interface (CFI). . . . . . . 22
Table 6. CFI Query Identification String.......................................... 22
SystemInterface String................................................................... 23
Table 8. Device Geometry Definition.............................................. 23
Table 9. Primary Vendor-Specific Extended Query........................ 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................24
Reset Command .....................................................................25
Autoselect Command Sequence ............................................25
Enter SecSi Sector/Exit SecSi Sector CommandSequence ..25
Word ProgramCommand Sequence .....................................25
Unlock Bypass Command Sequence ..............................................26
Figure 3. ProgramOperation.......................................................... 26
Chip Erase Command Sequence ...........................................26
Sector Erase Command Sequence ........................................27
Erase Suspend/Erase Resume Commands ...........................27
Figure 4. Erase Operation............................................................... 28
Command Definitions .............................................................29
Command Definitions...................................................................... 29
Write Operation Status . . . . . . . . . . . . . . . . . . . . .30
DQ7: Data#Polling .................................................................30
Figure 5. Data#Polling Algorithm................................................... 30
RY/BY#: Ready/Busy#............................................................31
DQ6: Toggle Bit I ....................................................................31
Figure 6. Toggle Bit Algorithm........................................................ 31
DQ2: Toggle Bit II ...................................................................32
Reading Toggle Bits DQ6/DQ2 ...............................................32
DQ5: Exceeded Timng Limts ................................................32
DQ3: Sector Erase Timer .......................................................32
Table 11. Write Operation Status ...................................................33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 7. MaximumNegative OvershootWaveform..................... 34
Figure 8. MaximumPositive OvershootWaveform....................... 34
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 9. I
CC1
Current vs. Time (Showing
ActiveandAutomaticSleepCurrents)........................................... 36
Figure 10. Typical I
vs. Frequency............................................ 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 11. Test Setup.................................................................... 37
Table 12. Test Specifications .........................................................37
Key to Switching Waveforms. . . . . . . . . . . . . . . . 37
Figure 12. Input Waveforms and
Measurement Levels...................................................................... 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Read-Only Operations ...........................................................38
Figure 13. Read Operation Timngs............................................... 38
Hardware Reset (RESET#) ....................................................39
Figure 14. Reset Timngs............................................................... 39
Erase and ProgramOperations ..............................................40
Figure 15. ProgramOperation Timngs.......................................... 41
Figure 16. Accelerated ProgramTimng Diagram.......................... 41
Figure 17. Chip/Sector Erase Operation Timngs.......................... 42
Figure 18. Data# Polling Timngs
(During Embedded Algorithms)...................................................... 43
Figure 19. Toggle Bit Timngs
(During Embedded Algorithms)...................................................... 44
Figure 20. DQ2 vs. DQ6................................................................. 44
Temporary Sector Unprotect ..................................................45
Figure 21. Temporary Sector Group Unprotect TimngDiagram... 45
Figure 22. Sector Group Protect and Unprotect TimngDiagram.. 46
Alternate CE#Controlled Erase and ProgramOperations .....47
Figure 23. Alternate CE#Controlled Write
(Erase/Program OperationTimngs.............................................. 48
Erase And Programming Performance . . . . . . . 49
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 50
SSO056
—
56-Pin Shrink Small Outline Package (SSOP) ......50
FBE063
—
63-Ball Fine-Pitch Ball Grid Array
(FBGA) 12x11mmpackage .................................................51
LAA064
—
64-Ball Fortified Ball Grid Array
(
F
BGA) 13x11mmpackage .................................................52
TS 048
—
48-Pin Standard TSOP ............................................53
TSR048
—
48-Pin Reverse TSOP ...........................................54
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
相关PDF资料
PDF描述
Am29LV640DL101RZE 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI Control
Am29LV641DL101RZE 64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI Control
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