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| 型号： | AM42BDS640AGBC8IT |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA93 |
| 封装： | 8 X 11.60 MM, FBGA-93 |
| 文件页数： | 4/72页 |
| 文件大小： | 1064K |
| 代理商： | AM42BDS640AGBC8IT |
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November 1, 2002
Am42BDS640AG
11
P R E L I M INARY
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. T he r egis ter is a l a tch us ed to s t ore th e
commands, along with the address and data informa-
tion needed to execute the command. The contents of
the register serve as inputs to the internal state ma-
chine. The state machine outputs dictate the function
of the device. Table 1 lists the device bus operations,
the inputs and control levels they require, and the re-
sulting output. The following subsections describe
each of these operations in further detail.
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相关代理商/技术参数 |
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| AM42BDS640AGBC9IS | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBC9IT | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD8IS | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD8IT | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD9I | 制造商:Spansion 功能描述:COMBO 4MX16 FALSH + 1MX16 SRAM 1.8V 93FBGA - Trays |
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