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参数资料
型号： AM42BDS640AGBC8IT
厂商： SPANSION LLC
元件分类： 存储器
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA93
封装： 8 X 11.60 MM, FBGA-93
文件页数： 45/72页
文件大小： 1064K
代理商： AM42BDS640AGBC8IT
4
Am42BDS640AG
November 1, 2002
P R E L I M INARY
Figure 24. Alternate Synchronous Program Operation Timings ..... 54
Figure 25. Chip/Sector Erase Command Sequence ....................... 55
Figure 26. Accelerated Unlock Bypass Programming Timing......... 56
Figure 27. Data# Polling Timings (During Embedded Algorithm) ... 57
Figure 28. Toggle Bit Timings (During Embedded Algorithm)......... 57
Figure 29. Synchronous Data Polling Timings/Toggle Bit Timings . 58
Figure 30. Latency with Boundary Crossing ................................... 59
Figure 31. Latency with Boundary Crossing
into Program/Erase Bank ................................................................ 60
Figure 32. Example of Wait States Insertion (Standard
Handshaking Device) ...................................................................... 61
Figure 33. Back-to-Back Read/Write Cycle Timings ....................... 62
SRAM AC Characteristics . . . . . . . . . . . . . . . . . . 63
Read Cycle ............................................................................. 63
Figure 34. SRAM Read Cycle—Address Controlled....................... 63
Figure 35. SRAM Read Cycle ......................................................... 64
Write Cycle ............................................................................. 65
Figure 36. SRAM Write Cycle—WE# Control ................................ 65
Figure 37. SRAM Write Cycle—CE1#s Control ............................. 66
Figure 38. SRAM Write Cycle—UB#s and LB#s Control ............... 67
Flash Erase And Programming Performance
. 68
Flash Latchup Characteristics. . . . . . . . . . . . . . . 68
Package Pin Capacitance . . . . . . . . . . . . . . . . . . 68
Flash Data Retention . . . . . . . . . . . . . . . . . . . . . . 68
SRAM Data Retention . . . . . . . . . . . . . . . . . . . . . 69
Figure 39. CE1#s Controlled Data Retention Mode....................... 69
Figure 40. CE2s Controlled Data Retention Mode......................... 69
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 70
FSC093—93-Ball Fine-Pitch Grid Array 8 x 11.6 mm ............ 70
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 71
Revision A (May 20, 2002) ..................................................... 71
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相关代理商/技术参数
参数描述
AM42BDS640AGBC9IS 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBC9IT 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IS 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IT 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD9I 制造商:Spansion 功能描述:COMBO 4MX16 FALSH + 1MX16 SRAM 1.8V 93FBGA - Trays
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