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参数资料
| 型号： | AMMC-6442-W50 |
| 元件分类： | 放大器 |
| 英文描述： | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | DIE |
| 文件页数： | 7/8页 |
| 文件大小： | 274K |
| 代理商： | AMMC-6442-W50 |
7
Recommended
Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin llet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. To optimize perfor-
mance for this device, the RF connections should be kept
at approximately 9mils in length using 1mil gold bond
wire. The recommended wire bonding stage temperature
is 150±2C.
Figure 15. Die dimensions
0
96
300
260
550
580
800
Vd3
GND
Vg2
Vg3
Vd1
GND
Vd2
Vd3
Vg1
1800
1000
2650
2000
2070
2650
1000
2000
2070
1075
1800
RF_IN
RF_OUT
The chip is 100
Pm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
For more detailed information, see Avago Application
Note 54 “GaAs MMIC ESD, Die Attach and Bonding Guide-
lines.”
Notes:
1. Sumitomo 1295SA silver epoxy is recommended.
2. Eutectic attach is not recommended any may jeopardize reliability of
the device
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| AMMC-6545-W10 | 18000 MHz - 45000 MHz RF/MICROWAVE SINGLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
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| AMMC-6550-W50 | 15000 MHz - 50000 MHz RF/MICROWAVE TRIPLE BALANCED MIXER, 10 dB CONVERSION LOSS-MAX |
| AMMP-5024 | 0.1 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
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相关代理商/技术参数 |
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