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参数资料
| 型号： | AMMP-5618-BLK |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | SMT, 8 PIN |
| 文件页数： | 7/9页 |
| 文件大小： | 241K |
| 代理商： | AMMP-5618-BLK |
7
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conduc-
tive epoxy is not recom-
mended. Hand soldering is not
recommended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified
to withstand a peak tempera-
ture of 260
°C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
Dimensional Tolerances: 0.002" [0.05 mm]
12
3
76
5
32
1
56
7
.200 [5.08]
84
.075 [1.91]
.114 [2.9]
.014 [0.365]
.016 [0.40]
.012 [0.30]
.028 [0.70]
.093 [2.36]
.016 [0.40]
.100 [2.54]
.011 [0.28]
.018 [0.46]
.126 [3.2]
.059 [1.5]
.100 [2.54]
.029 [0.75]
4
8
Front View
Side View
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
.093 [2.36]
.010 [0.25]
.011 [0.28]
.126 [3.20]
.059 [1.50] .020 [0.50]
.018 [0.46]
.114 [2.90]
.0095 [0.24]
.012 [0.3]
.016 [0.40]
.0095 [0.24]
.016 [0.40]
Figure 23. Suggested PCB Material and Land Pattern.
Figure 22. Outline Drawing.
相关PDF资料 |
PDF描述 |
|---|---|
| AMMP-5618-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-BLK | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-5618-TR1 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5618-TR2 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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