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参数资料
| 型号： | AMMP-5618-BLK |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | SMT, 8 PIN |
| 文件页数： | 8/9页 |
| 文件大小： | 241K |
| 代理商： | AMMP-5618-BLK |
8
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
Figure 25. Stencil Outline Drawing (mm).
Figure 26. Combined PCB and Stencil Layouts (mm).
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 24. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 1 will vary among differ-
ent solder pastes from different
manufacturers and is shown here
for reference only.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of solder
paste is deposited onto the PCB
pads. The recommended stencil
layout is shown in Figure 25. The
stencil has a solder paste deposi-
tion opening approximately 70%
to 90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil
openings larger than 100% will
lead to excessive solder paste
smear or bridging across the I/O
pads. Considering the fact that
solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use a laser cut stencil composed
of 0.127 mm (5 mils) thick
stainless steel which is capable of
producing the required fine
stencil outline.
The combined PCB and stencil
layout is shown in Figure 26.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(°
C)
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Peak = 250
± 5°C
Melting point = 218
°C
0.36
0.40
0.70
0.27
0.36
4x - R0.14
0.95
0.36
0.60
1.60
0.9550
1.80
3.20 1.80 0.40
0.36
2.90
1.60
Stencil
Opening
0.30
0.27
0.40
0.36
0.46
0.40
0.60
0.67
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相关代理商/技术参数 |
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| AMMP-5618-TR1 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5618-TR2 | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射频放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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