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参数资料
型号： AMMP-6220-BLK
厂商： AGILENT TECHNOLOGIES INC
元件分类： 放大器
英文描述： 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
封装： SMT, 8 PIN
文件页数： 8/10页
文件大小： 382K
代理商： AMMP-6220-BLK
7
Outline Drawing
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended sol-
der reflow profile. Conductive
epoxy is not recommended.
Hand soldering is not recom-
mended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified to
withstand a peak temperature
of 260
°C for 20 seconds. Verify
that the profile will not expose
device beyond these limits.
Suggested PCB Material and Land Pattern
Figure 22. Outline Drawing.
Figure 23.
3
2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
56
7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
NOTES:
1. * INDICATES PIN 1
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
DIMENSIONAL TOLERANCES: 0.002" (0.05 mm)
1
2
3
7
6
5
4
8
0.075 (1.91)
0.200 (5.08)
0.200
(5.08)
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW
*
0.010
(0.25)
0.093
(2.36)
0.011 (0.28)
0.016(0.40)
0.0095 (0.24)
0.012 (0.30)
0.016 (0.40)
GROUND VIAS SHOULD
BE SOLDER FILLED
0.020 (0.50)
0.059 (1.50)
0.126 (3.20)
INCHES (MILLIMETERS).
MATERIAL IS ROGERS RO4350, 0.010-INCH THICK.
0.018 (0.46)
0.0095 (0.24)
0.114 (2.90)
相关PDF资料
PDF描述
AMMP-6220-TR1 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6220-TR2 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6220-BLK 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6220-TR1 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6220-TR2 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
相关代理商/技术参数
参数描述
AMMP-6220-TR1 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6220-TR2 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6222 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity LNA in SMT Package
AMMP-6222-BLKG 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6222-TR1G 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
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