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参数资料
| 型号： | AMMP-6220-BLK |
| 厂商： | AGILENT TECHNOLOGIES INC |
| 元件分类： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | SMT, 8 PIN |
| 文件页数： | 9/10页 |
| 文件大小： | 382K |
| 代理商： | AMMP-6220-BLK |
8
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 25. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 25 will vary among differ-
ent solder pastes from different
manufacturers and is shown here
for reference only.
Figure 24. Suggested lead-free reflow profile for SnAgCu solder paste.
Figure 25. Stencil outline drawing (mm).
Stencil Design Guidelines
A properly designed solder screen
or stencil is required to ensure
optimum amount of solder paste
is deposited onto the PCB pads.
The recommended stencil layout
is shown in Figure 26. The stencil
has a solder paste deposition
opening approximately 70% to
90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil open-
ings larger than 100% will lead to
excessive solder paste smear or
bridging across the I/O pads.
Considering the fact that solder
paste thickness will directly affect
the quality of the solder joint, a
good choice is to use a laser cut
stencil composed of 0.127 mm
(5 mils) thick stainless steel which
is capable of producing the re-
quired fine stencil outline. The
combined PCB and stencil layout
is shown in Figure 27.
Figure 26. Combined PCB and stencil layouts (mm).
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TEMPERA
TURE
(°
C)
PEAK = 250
± 5°C
MELTING POINT = 218
°C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
0.60
1.80
3.20
0.67
0.36
0.40
0.27
0.30
2.90
1.60
STENCIL
OPENING
0.36
0.40
0.46
0.60
0.95
0.40
0.36
4x – R0.14
1.60
0.70
0.9550
1.80
0.27
0.36
相关PDF资料 |
PDF描述 |
|---|---|
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-BLK | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-6220-TR1 | 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6220-TR2 | 功能描述:射频放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6222 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity LNA in SMT Package |
| AMMP-6222-BLKG | 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6222-TR1G | 功能描述:射频放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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