参数资料
型号: AMMP-6441-BLKG
元件分类: 放大器
英文描述: 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封装: 5 X 5 MM, ROHS COMPLIANT, SMT, 8 PIN
文件页数: 2/12页
文件大小: 366K
代理商: AMMP-6441-BLKG
10
Figure 19. Suggested Lead-Free Reow Prole for SnAgCu Solder Paste
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
4. Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room temper-
ature to the pre-heat temp. to avoid damage due to
thermal shock.
6. Packages have been qualied to withstand a peak tem-
perature of 260°C for 20 seconds. Verify that the prole
will not expose device beyond these limits.
AMMP-64xx Part Number Ordering Information
Part Number
Devices Per
Container
AMMP-64xx-BLKG
10
Antistatic bag
AMMP-64xx-TR1G
100
7” Reel
AMMP-64xx-TR2G
500
7” Reel
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 18b. The stencil has a solder paste depo-
8b. The stencil has a solder paste depo-
b. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is accom-
plished in a belt furnace using convection heat transfer.
The suggested reow prole for automated reow
processes is shown in Figure 19. This prole is designed
to ensure reliable nished joints. However, the prole
indicated in Figure 1 will vary among dierent solder
pastes from dierent manufacturers and is shown here for
reference only.
0
50
100
150
200
250
300
050
100
150
200
250
300
Seconds
Temp
C)
Peak = 250 ± 5°C
Ramp 1
Preheat Ramp 2Re-ow
Melting point = 218°C
Cooling
相关PDF资料
PDF描述
AMMP-6441-TR1G 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6441-TR2G 36000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
AMMP-6522-TR2 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6522-BLK 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMT-20033-401 12000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
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