参数资料
型号: AMMP-6442-TR2
元件分类: 放大器
英文描述: 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封装: 5 X 5 MM, ROHS COMPLIANT, CERAMIC, SMT-8
文件页数: 9/10页
文件大小: 359K
代理商: AMMP-6442-TR2
8
Figure 15. Suggested Lead-Free Reow Prole for SnAgCu Solder Paste
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder paste.
Please see recommended solder reow prole. Neither
Conductive epoxy or hand soldering is recommended.
x Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
x Packages have been qualied to withstand a peak
temperature of 260
qC for 20 seconds. Verify that the
prole will not expose device beyond these limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 14b. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly aect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required ne stencil outline.
The most commonly used solder reow method is accom-
plished in a belt furnace using convection heat transfer.
The suggested reow prole for automated reow
processes is shown in Figure 15. This prole is designed
to ensure reliable nished joints. However, the prole
indicated in Figure 1 will vary among dierent solder
pastes from dierent manufacturers and is shown here for
reference only.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(°C)
Peak = 250 ± 5°C
Ramp 1
Preheat Ramp 2
Reow
Melting point = 218°C
Cooling
AMMP-64xx Part Number Ordering Information
Part Number
Devices Per
Container
AMMP-64xx-BLK
10
Antistatic bag
AMMP-64xx-TR1
100
7” Reel
AMMP-64xx-TR2
500
7” Reel
相关PDF资料
PDF描述
AS006L2-00 0 MHz - 6000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.2 dB INSERTION LOSS
AS006L2-93 0.3 MHz - 6000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.8 dB INSERTION LOSS
AS186-302 0 MHz - 4000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.25 dB INSERTION LOSS
AT10-0009 800 MHz - 1000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 4.2 dB INSERTION LOSS-MAX
AT10-0009TR 800 MHz - 1000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 4.2 dB INSERTION LOSS-MAX
相关代理商/技术参数
参数描述
AMMP-6442-TR2G 功能描述:射频放大器 35-40 GHz Power Amp Linear Power Amp RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6522-BLKG 功能描述:射频放大器 LNA IR Mixer 6-22GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6522-TR1G 功能描述:射频放大器 LNA IR Mixer 6-22GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6522-TR2G 功能描述:射频放大器 LNA IR Mixer 6-22GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
AMMP-6530 制造商:AGILENT 制造商全称:AGILENT 功能描述:5-30 GHz Image Reject Mixer