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参数资料
| 型号： | AMMP-6522-TR2 |
| 元件分类： | 放大器 |
| 英文描述： | 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 7 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件页数： | 2/14页 |
| 文件大小： | 618K |
| 代理商： | AMMP-6522-TR2 |
10
Recommended SMT Attachment for 5x5 Package
TheAMMPPackagedDevicesarecompatiblewithhigh
volumesurfacemountPCBassemblyprocesses.
The PCB material and mounting pattern, as defined in
thedatasheet,optimizesRFperformanceandisstrong-
ly recommended. An electronic drawing of the land
pattern is available upon request from Agilent Sales &
ApplicationEngineering.
Manual Assembly
FollowESDprecautionswhilehandlingpackages.
Handlingshouldbealongtheedgeswithtweezers.
Recommended attachment is conductive solder
paste.Pleaseseerecommendedsolderreflowprofile.
Neither Conductive epoxy or hand soldering is
recommended.
Applysolderpasteusingastencilprinterordotplace-
ment.Thevolumeofsolderpastewillbedependent
on PCB and component layout and should be con-
trolledtoensureconsistentmechanicalandelectrical
performance.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profilewillhaveasteadyrampupfromroomtemper-
aturetothepre-heattemp.toavoiddamagedueto
thermalshock.
Packageshavebeenqualifiedtowithstandapeaktem-
peratureof260°Cfor20seconds.Verifythattheprofile
willnotexposedevicebeyondtheselimits.
Aproperlydesignedsolderscreenorstencilisrequired
toensureoptimumamountofsolderpasteisdeposited
ontothePCBpads.Therecommendedstencillayoutis
showninFigure21.Thestencilhasasolderpastedeposi-
tionopeningapproximately70%to90%ofthePCBpad.
Reducingstencilopeningcanpotentiallygeneratemore
voidsunderneath.Ontheotherhand,stencilopenings
largerthan100%willleadtoexcessivesolderpastesmear
orbridgingacrosstheI/Opads.Consideringthefactthat
solderpastethicknesswilldirectlyaffectthequalityof
thesolderjoint,agoodchoiceistousealasercutstencil
composedof0.127mm(5mils)thickstainlesssteelwhich
iscapableofproducingtherequiredfinestenciloutline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 22. This profile is
designedtoensurereliablefinishedjoints.However,the
profile indicated in Figure 1 will vary among different
solderpastesfromdifferentmanufacturersandisshown
hereforreferenceonly.
相关PDF资料 |
PDF描述 |
|---|---|
| AMMP-6522-BLK | 700 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMT-20033-401 | 12000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMT-8033-501 | 4000 MHz - 8000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AWT-10533-301 | 4500 MHz - 10500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AWT-10533-501 | 4500 MHz - 10500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AMMP-6522-TR2G | 功能描述:射频放大器 LNA IR Mixer 6-22GHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
| AMMP-6530 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:5-30 GHz Image Reject Mixer |
| AMMP-6530-BLK | 功能描述:射频混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| AMMP-6530-TR1 | 功能描述:射频混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| AMMP-6530-TR2 | 功能描述:射频混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 频率范围: 转换损失——最大: 工作电源电压:6 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
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