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参数资料
| 型号： | AMS302 |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | SENSOR LIGHT NAPICA 6V 5MM RND |
| 产品目录绘图： | AMS104Y AMS104Y Circuit |
| 标准包装： | 500 |
| 带接近传感器： | 无 |
| 波长： | 580nm |
| 电源电压： | 1.5 V ~ 6 V |
| 电流 - 暗（标准）： | 300nA |
| 电流 - 光（典型值）： | 260µA |
| 输出类型： | 电流 |
| 工作温度： | -30°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 包装： | 散装 |
| 产品目录页面： | 2780 (CN2011-ZH PDF) |
| 其它名称： | 255-2655 |
Light Sensor (AMS1, 3, 4)
3. Chip type
(0.30)
CAD Data
(.012)
1
1.25
.049
(0.58)
(.023)
(0.23)
(.009)
1.45
.057
2.0
.079
2
1 Anode
2 Cathode
DETECTION AREA
Recommended mounting pad
(Top view)
(0.6)
(0.6)
(.024)
(.024)
(1.2)
(.047)
0.55
.022
(2.4)
(.094)
Mark for indicating orientation
(0.17)
1
Amplifier
2
(.007)
1 Anode (–)
2 Cathode (+)
SAFETY PRECAUTIONS
1.2
.047
General Tolerance: ± 0.1 ± .004
Be sure to obey the following in order to
prevent injuries and accidents.
? Do not use the sensors under
conditions that exceed the range of its
speci?cations. It may cause
overheating, smoke, or ?re.
CAUTIONS FOR USE
1. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate because of the excessive
voltage or current. In extreme cases,
wiring may melt, or silicon P/N junctions
may be destroyed.
Therefore the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
2. Deterioration and destruction
caused by discharge of static
electricity
This phenomenon is generally called
static electricity destruction. Static
electricity generated by various factors
?ows through the terminal and occurs to
destroy internal elements. To prevent
problems from static electricity, the
following precautions and measures
should be taken when using your device.
1) Person handling sensor should wear
anti-static clothing and should be
grounded through protective resistance
of 500 k ? to 1 M ? .
2) A conductive metal sheet should be
placed over the work table. Measuring
instruments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also
recommended.)
? Connect terminals correctly by verifying
the pin layout with the speci?cations
diagram or other instructions.
Erroneous connections may lead to
unexpected operating errors,
overheating, smoke, or ?re.
4) Devices and equipment used in
assembly should also be grounded.
5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an
electrostatic charge.
6) When storing or transporting sensor,
the environment should not be generated
static electricity (for instance, the
humidity should be between 45 and
60%), and sensor should be protected
using conductive packing materials.
3. Just after supplying voltage, please
note that current in the sensor will be
not constant until internal circuit
stability.
4. Storage
The sensors are transparent plastic
packages. They are sensitive to moisture
and come in moisture-proof packages.
Observe the following cautions when
storing.
1) After the moisture-proof package is
unsealed, take the sensors out of storage
as soon as possible (within 1 week
30 ° C 86 ° F /60% R.H.).
2) If the devices are to be left in storage
for a considerable period after the
moisture-proof package has been
unsealed, it is recommended to keep
them in another moisture-proof bag
containing silica gel (within 3 months at
the most).
? For an impotant and serious application
in terms of safety, add protection circuit
or any other protection method.
3) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
? Temperature: 0 to 30 ° C 32 to 86 ° F
? Humidity: Less than 60% R.H.
(Avoid freezing and condensing)
? Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
*When mounting with solder, if thermal
stress is applied to sensors that have
absorbed moisture, the moisture will
vaporize, swelling will occur, and the
inside of the package will become
stressed. This may cause the package
surface to blister or crack. Therefore,
please take caution and observe the
soldering conditions in the following
section.
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
ASCTB242E 201209-T
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