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| 型号： | AMS302 |
| 厂商： | Panasonic Electric Works |
| 文件页数： | 5/6页 |
| 文件大小： | 0K |
| 描述： | SENSOR LIGHT NAPICA 6V 5MM RND |
| 产品目录绘图： | AMS104Y AMS104Y Circuit |
| 标准包装： | 500 |
| 带接近传感器： | 无 |
| 波长： | 580nm |
| 电源电压： | 1.5 V ~ 6 V |
| 电流 - 暗（标准）： | 300nA |
| 电流 - 光（典型值）： | 260µA |
| 输出类型： | 电流 |
| 工作温度： | -30°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 包装： | 散装 |
| 产品目录页面： | 2780 (CN2011-ZH PDF) |
| 其它名称： | 255-2655 |
Light Sensor (AMS1, 3, 4)
5. Recommended soldering
conditions
<SMD/Chip type>
1) Recommended condition
(1) IR (Infrared re?ow) soldering method
T 3
T 2
T 1
2) The soldered position on leads should
not be closer than 3mm .118inch to the
molding resin of this sensor.
6. Notes for mounting
1) Temperature rise in the lead portion is
highly dependent on package size.
If multiple different packages are
mounted on the same board, please
check your board beforehand in an actual
product, ensuring that the temperature of
the solder area of the sensor terminals
8. Transportation
Extreme vibration during transport will
warp the lead or damage the sensor.
Handle the outer and inner boxes with
care.
9. Avoid using the sensor in
environments containing excessive
amounts of steam, dust, corrosive
gas, or where organic solvents are
present.
10. Lead forming and cutting of
t 1
t 2
falls within the temperature conditions of
through-hole type
T 1 = 150 to 180 ° C 302 to 356 ° F
T 2 = 230 ° C 446 ° F
T 3 = 250 ° C 482 ° F or less
t 1 = 60 to 120 s or less
t 2 = 30 s or less
(2) Soldering iron method
Tip temperature: 350 to 400 ° C 662 to
752 ° F
Wattage: 30 to 60 W
Soldering time: within 3 s
*We don’t recommend soldering iron
method for chip type.
2) Do not do ?ow soldering.
<Through-hole type>
1) Recommended condition
(1) Double wave soldering method
T 2
T 1
item 5.
2) If the mounting conditions exceed the
recommended solder conditions in item
5, resin strength will fall and the
mismatching of the heat expansion
coef?cient of each constituent material
will increase markedly, possibly causing
cracks in the package, disconnections of
bonding wires, and the like. For this
reason, please inquire with us about
whether this use is possible.
7. Cleaning solvents compatibility
We recommend dip cleaning with an
organic solvent for removal of solder ?ux
etc. If you cannot avoid using ultrasonic
cleansing, please ensure that the
following conditions are met, and check
beforehand for defects.
? Frequency: 27 to 29 kHz
? Ultrasonic power: No greater than
0.25W/cm 2
? Cleaning time: No longer than 30 s
1) Lead forming must be done at normal
temperature before soldering
2) The bent and cut position on leads
should not be closer than 3mm .118inch
to the base of leads.
3) Lead forming and cutting must be
done while ?xing the base of leads.
4) Avoid mounting with stress at the base
of leads.
t 1
T 1 = 120 ° C 248 ° F
T 2 = 260 ° C 500 ° F or less
t 2
t 3
? Cleanser used: Asahiklin AK-225
? Other:
Submerge in solvent in order to prevent
the PCB and sensors from being
t 1 = 120 s or less
t 2 +t 3 = 6 s or less
(2) Soldering iron method
Tip temperature: 350 to 400 ° C 662 to
752 ° F
contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic power for
ultrasonic baths.
Wattage: 30 to 60 W
Soldering time: within 3 s
11. The following shows the packaging format
1) SMD type tape and reel (mm inch )
Type
Tape dimensions
Dimensions of tape reel
21.0 ± 0.8 dia.
.827 ± .031 dia.
11.4 ± 1.0
.449 ± .039
Anode side
0.2 ± 0.05
.008 ± .002
Device
mounted
on tape
4.0 ± 0.1
.157 ± .004
Direction of
picking
2.0 ± 0.1
.079 ± .004
?
1.5 + 0.1 dia.
?
.059 + .004 dia.
1.75 ± 0.1
.069 ± .004
2.0 ± 0.5
.079 ± .020
178 ± 2 dia.
7.008 ± .079 dia.
Light sensor
NaPiCa
SMD type
AMS104Y
1.5 ± 0.3
.059 ± .012
3.6 ± 0.1
.142 ± .004
2.4 ± 0.1
.094 ± .004
4.0 ± 0.1
.157 ± .004
1.0 ± 0.1 dia.
.039 ± .004 dia.
8.0 ± 0.2
.315 ± .008
3.5 ± 0.1
.138 ± .004
60 ± 0.5 dia.
2.362 ± .020 dia.
Cathode side
Note) When picked from 1 and 4-pin side
(Please inquire for tape and reel packaging with 2-pin and 3-pin on the
pull-out side.)
13.0 ± 0.5 dia.
.512 ± .020 dia.
9.0 ± 0.3
.354 ± .012
ASCTB242E 201209-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
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