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参数资料
| 型号： | AN-994-1 |
| 厂商： | International Rectifier |
| 英文描述： | MAXIMIZING THE EFFECTIVENESS OF YOUR SMD ASSEMBLIES |
| 中文描述： | 最大限度地发挥你的贴片组件效果 |
| 文件页数： | 3/7页 |
| 文件大小： | 120K |
| 代理商： | AN-994-1 |
Section II: Thermal Characterization of Surface
Mount Packages
Table 1 shows typical and Maximum R
th (JA)
and typical
R
th (JL)
values of the SMD packages presently offered
by International Rectifier. For R
th (JC)
values, please
refer to the appropriate data sheet.
Measurements are provided for devices mounted on
three different PCB patterns: 1 square inch (“1 sq”),
modified minimum area, and minimum area, as
described graphically in Figure 1.
3 of 7
Based on the Max R
th
(JA)
values in Table 1 please see
in Figures 2-4 the graphs of power dissipation vs.
ambient temperature for each type of PCB pattern.
Note that generally the larger packages with exposed
heat sinks (D2-Pak, D-Pak & SOT-223) have the
highest Power Dissipation capabilities.
Note also that the larger the metallized PCB pattern
area, the lower will be the thermal resistance.
Measurements at 3 different PCB pattern Areas reflect
this sensitivity.
.
Table 1
: R
th
typical and max values for various SMD packages
Typ R
th(JA)
Max R
th(JA)
169.2
73.4
60.9
47.1
39.9
47.3
54.5
27.2
32.1
33.5
32.3
20.2
18.0
Typ R
th(JA)
Max R
th(JA)
237.1
134.7
106.4
112.5
102.4
112.0
73.1
49.0
49.2
66.3
55.6
42.0
33.6
Typ R
th(JA)
Max R
th(JA)
263.6
170.7
117.0
124.9
126.1
118.5
94.7
66.1
68.1
70.6
62.2
59.5
36.7
u-3
230.0
125.0
83.0
75.0
70.0
62.5
62.5
60.0
58.0
50.0
45.0
26.3
23.3
308.2
175.1
138.3
146.3
133.2
145.6
95.1
63.7
64.0
86.2
72.3
54.6
43.7
342.6
222.0
152.1
162.4
163.9
154.0
123.1
86.0
88.5
91.8
80.9
77.3
47.7
139.3
35.5
35.5
14.7
17.0
17.0
28.7
4.9
NA
10.6
NA
2.0
1.6
TSOP6 (Dual)
TSSOP8
u-6
u-8
TSOP6 (Sngle)
SO-8 (Dual)
SOT-223
Small-can DrectFET
SO-8
Md-can DrectFET
D-Pak
D2-Pak
Package type
R
th
(Sample Size 3 pc/package type)
Modified Mnimum
1sq"
Mnimum
Typ R
th(JL)
*
NOTES:
1. * The R
th (JL)
& the R
th (JA)
1sq" were measured at the same time. R
th
reference to drain lead.
2. See Section I for details of measurement conditions.
3. The PCB contributes greatly to the total R
th.
If PCB material properties or dimensions vary significantly
from those used by IR, actual R
th (actual)
results may also vary.
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