参数资料
型号: AN-CC1002
厂商: WINBOND ELECTRONICS CORP
英文描述: Design Considerations for ISD1700 Family
中文描述: 设计注意事项ISD1700系列
文件页数: 2/3页
文件大小: 138K
代理商: AN-CC1002
Design Considerations for ISD1700 Family
Also, avoid running the signal traces close to the V
CCP,
V
SSP1
and V
SSP2
traces.
3.1 Layout Example
The above diagrams represent a generic layout for ISD1730 or ISD1760 device as an
example. In the diagrams, the die is magnified in order to review clearly the locations
of the related power and ground pads, as well as the components. Hence, the
illustrations are not in 1:1 ratio.
4. Physical Dimension of PCB
Experiment 1:
AN-CC1002
January, 2006
Page 2 / 3
The first experiment uses a large PCB. The layout follows the above guidelines with
both 0.1
μ
F and 10
μ
F capacitors installed on all V
CCA
, V
CCD
and V
CCP
power lines. It
produces excellent voice quality on the recorded message.
If 10
μ
F capacitors are removed from all power lines, the voice quality slightly
degrades. However, it may still be acceptable for certain kinds of applications. The
PCB dimension is approximately 4 inches x 3 inches. Fig. 3 shows the 1:1 ratio of
the size of the PCB.
Experiment 2:
In the second experiment which tries to simulate the practical case for mass
production environment, a much smaller PCB is used. When both 0.1
μ
F and 10
μ
F
capacitors are installed on all V
CCA
, V
CCD
and V
CCP
power lines; a very good voice
Fig. 1: One side of PCB
V+
Gnd
V
CCD
V
CCA
V
SSD
V
SSA
IS D 1 7 0 0
V+
Gnd
V
CCP
V
SSP1
IS D 1 7 0 0
V
SSP2
Fig. 2: Another side of PCB
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