参数资料
| 型号： | AP9050FDB-7 |
| 厂商： | Diodes Inc |
| 文件页数： | 3/9页 |
| 文件大小： | 0K |
| 描述： | IC PMIC INTERFACE PROT UDFN2020 |
| 标准包装： | 1 |
| 应用： | 便携式设备 |
| 电流 - 电源： | 110µA |
| 电源电压： | 3 V ~ 30 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UDFN 裸露焊盘 |
| 供应商设备封装： | 6-UDFN2020（2x2） |
| 包装： | 标准包装 |
| 其它名称： | AP9050FDB-7DIDKR |
AP9050
PROTECTION INTERFACE for PMICs with
INTEGRATED OVP CONTROL
Absolute Maximum Ratings (Note 2, 3)
Symbol
V IN
V GS
I Dpk
Parameter
Supply Voltage
Gate-to-Source Voltage
Drain Current, Peak (10μs pulse)
Rating
? 0.3 to 30
±12
19
Unit
V
V
A
Drain Current, Continuous
I D
(Note 4, Steady-State)
T A = 25oC
3.7
2.7
A
T A = 85oC
P max
T J
T J
T L
Total Power Dissipation @ T A = 25°C
(Note 3, 4)
Junction Temperature Range
Non-operating Temperature Range
Maximum Lead Temperature for Soldering
Purposes
750
? 40 to +125
? 55 to +150
260
mW
°C
°C
°C
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and
transporting these devices.
Notes:
2. Exceeding these ratings may damage the device.
2
3. Mounted on FR4 Board using 30 mm , 2 oz Cu.
4. Dual die operation (equally ? heated).
Thermal Resistance
Symbol
θ JA
θ JC
Parameter
Junction to Ambient (Note 5)
Junction to Case
Rating
132
13
Unit
°C/W
°C/W
Note:
2
5. Test condition for DFN2020-6: Mounted on FR4 Board using 30 mm , 2 oz Cu.
Recommended Operating Conditions (Note 6)
Symbol
V IN
T A
Parameter
Supply Voltage
Operating Ambient Temperature Range
Min
3
? 40
Max
30
+85
Unit
V
°C
Note:
6. The device function is not guaranteed outside of the recommended operating conditions.
AP9050
Document number: DS35283 Rev. 1 - 2
3 of 9
March 2011
? Diodes Incorporated
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