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参数资料
型号： APA1000-FG896I
厂商： Microsemi SoC
文件页数： 110/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 1M 896-FBGA
标准包装： 27
系列： ProASICPLUS
RAM 位总计： 202752
输入/输出数： 642
门数： 1000000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 896-BGA
供应商设备封装： 896-FBGA（31x31）
ProASICPLUS Flash Family FPGAs
v5.9
2-27
Package Thermal Characteristics
The ProASICPLUS family is available in several package
types with a range of pin counts. Actel has selected
packages based on high pin count, reliability factors, and
superior thermal characteristics.
Thermal resistance defines the ability of a package to
conduct heat away from the silicon, through the
package to the surrounding air. Junction-to-ambient
thermal resistance is measured in degrees Celsius/Watt
and is represented as Theta ja
(Θja). The lower the
thermal resistance, the more efficiently a package will
dissipate heat.
A package’s maximum allowed power (P) is a function of
maximum junction temperature (TJ), maximum ambient
operating temperature (TA), and junction-to-ambient
thermal resistance Θja. Maximum junction temperature is
the maximum allowable temperature on the active
surface of the integrated circuit (IC) and is 110°C. P is
defined as shown in
EQ 2-4:
EQ 2-4
Θ
ja is a function of the rate (in linear feet per minute
(lfpm)) of airflow in contact with the package. When the
estimated power consumption exceeds the maximum
allowed power, other means of cooling, such as
increasing the airflow rate, must be used. The maximum
power dissipation allowed for a Military temperature
device is specified as a function of Θjc. The absolute
maximum junction temperature is 150°C.
The calculation of the absolute maximum power
dissipation
allowed
for
a
Military
temperature
application is illustrated in the following example for a
456-pin PBGA package:
EQ 2-5
P
T
J
T
A
–
Θ
ja
-----------------
=
Table 2-16 Package Thermal Characteristics
Plastic Packages
Pin Count
θ
jc
θ
ja
Units
Still Air
1.0 m/s
200 ft./min.
2.5 m/s
500 ft./min.
Thin Quad Flat Pack (TQFP)
100
14.0
33.5
27.4
25.0
°C/W
Thin Quad Flat Pack (TQFP)
144
11.0
33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)1
208
8.0
26.1
22.5
20.8
°C/W
PQFP with heat spreader2
208
3.8
16.2
13.3
11.9
°C/W
Plastic Ball Grid Array (PBGA)
456
3.0
15.6
12.5
11.6
°C/W
Fine Pitch Ball Grid Array (FBGA)
144
3.8
26.9
22.9
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)
256
3.8
26.6
22.8
21.5
°C/W
Fine Pitch Ball Grid Array (FBGA)3
484
3.2
18.0
14.7
13.6
°C/W
Fine Pitch Ball Grid Array (FBGA)4
484
3.2
20.5
17.0
15.9
°C/W
Fine Pitch Ball Grid Array (FBGA)
676
3.2
16.4
13.0
12.0
°C/W
Fine Pitch Ball Grid Array (FBGA)
896
2.4
13.6
10.4
9.4
°C/W
Fine Pitch Ball Grid Array (FBGA)
1152
1.8
12.0
8.9
7.9
°C/W
Ceramic Quad Flat Pack (CQFP)
208
2.0
22.0
19.8
18.0
°C/W
Ceramic Quad Flat Pack (CQFP)
352
2.0
17.9
16.1
14.7
°C/W
Ceramic Column Grid Array (CCGA/LGA)
624
6.5
8.9
8.5
8.0
°C/W
Notes:
1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300
2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000
3. Depopulated array
4. Full array
Maximum Power Allowed
Max. junction temp. (
°C) Max. case temp. (°C)
–
θ
jc(°C/W)
-----------------------------------------------------------------------------------------------------------------------------
150
°C125°C
–
3.0
°C/W
----------------------------------------
8.333W
=
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APA1000-FG896M 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 1M Gates 180MHz 0.22um (CMOS) Technology 2.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA ProASICPLUS Family 1M Gates 180MHz 0.22um Technology 2.5V 896-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA PROASICPLUS 1M GATES 180MHZ 0.22UM 2.5V 896FBGA - Trays
APA1000-FGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA1000-FGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA1000-FGG1152 功能描述:IC FPGA PROASIC+ 1M 1152-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA1000-FGG1152I 功能描述:IC FPGA PROASIC+ 1M 1152-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
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