参数资料
型号: APA1000-FGG896A
厂商: Microsemi SoC
文件页数: 125/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 1M 896-FBGA
标准包装: 27
系列: ProASICPLUS
RAM 位总计: 202752
输入/输出数: 642
门数: 1000000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: -40°C ~ 125°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
ProASICPLUS Flash Family FPGAs
2- 40
v5.9
Table 2-25 DC Specifications (3.3 V PCI Operation)1
Symbol
Parameter
Condition
Commercial/
Industrial2
Military/MIL-STD- 8832
Units
Min.
Max.
Min.
Max.
VDD
Supply Voltage for Core
2.3
2.7
2.3
2.7
V
VDDP
Supply Voltage for I/O Ring
3.0
3.6
3.0
3.6
V
VIH
Input High Voltage
0.5VDDP VDDP + 0.5
0.5VDDP
VDDP + 0.5
V
VIL
Input Low Voltage
–0.5
0.3VDDP
–0.5
0.3VDDP
V
IIPU
Input Pull-up Voltage3
0.7VDDP
V
IIL
Input Leakage Current4
0 < VIN < VDDP
Std.
–10
10
–50
50
μA
VOH
Output High Voltage
IOUT = –500 A
0.9VDDP
V
VOL
Output Low Voltage
IOUT = 1500 A
0.1VDDP
V
CIN
Input Pin Capacitance (except CLK)
10
pF
CCLK
CLK Pin Capacitance
5
12
5
12
pF
Notes:
1. For PCI operation, use GL33, OTB33PH, OB33PH, IOB33PH, IB33, or IB33S macro library cell only.
2. All process conditions. Junction Temperature: –40 to +110°C for Commercial and Industrial devices and –55 to +125°C for Military.
3. This specification is guaranteed by design. It is the minimum voltage to which pull-up resistors are calculated to pull a floated
network. Designers with applications sensitive to static power utilization should ensure that the input buffer is conducting minimum
current at this input voltage.
4. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.
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