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参数资料
型号： APA450-FG484A
厂商： Microsemi SoC
文件页数： 111/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 450K 484-FBGA
标准包装： 40
系列： ProASICPLUS
RAM 位总计： 110592
输入/输出数： 344
门数： 450000
电源电压： 2.375 V ~ 2.625 V
安装类型： 表面贴装
工作温度： -40°C ~ 125°C
封装/外壳： 484-BGA
供应商设备封装： 484-FPBGA（23x23）
ProASICPLUS Flash Family FPGAs
2- 28
v5.9
Calculating Typical Power Dissipation
ProASICPLUS device power is calculated with both a static and an active component. The active component is a function
of both the number of tiles utilized and the system speed. Power dissipation can be calculated using the following
formula:
Total Power Consumption—Ptotal
Ptotal = Pdc + Pac
where:
Global Clock Contribution—Pclock
Pclock, the clock component of power dissipation, is given by the piece-wise model:
for R < 15000 the model is: (P1 + (P2*R) – (P7*R2)) * Fs (lightly-loaded clock trees)
for R > 15000 the model is: (P10 + P11*R) * Fs (heavily-loaded clock trees)
where:
Storage-Tile Contribution—Pstorage
Pstorage, the storage-tile (Register) component of AC power dissipation, is given by
Pstorage = P5 * ms * Fs
where:
Pdc =
7 mW for the APA075
8 mW for the APA150
11 mW for the APA300
12 mW for the APA450
12 mW for the APA600
13 mW for the APA750
19 mW for the APA1000
Pdc includes the static components of PVDDP + PVDD + PAVDD
Pac =Pclock + Pstorage + Plogic + Poutputs + Pinputs + Ppll + Pmemory
P1
= 100 W/MHz is the basic power consumption of the clock tree per MHz of the clock
P2
= 1.3 W/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of the
clock
P7
= 0.00003 W/MHz is a correction factor for partially-loaded clock trees
P10
= 6850 W/MHz is the basic power consumption of the clock tree per MHz of the clock
P11
= 0.4 W/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of
the clock
R
= the number of storage tiles clocked by this clock
Fs
= the clock frequency
P5
=
1.1 W/MHz is the average power consumption of a storage tile per MHz of its output toggling rate.
The maximum output toggling rate is Fs/2.
ms
=
the number of storage tiles (Register) switching during each Fs cycle
Fs
=
the clock frequency
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相关代理商/技术参数
参数描述
APA450-FG484I 功能描述:IC FPGA PROASIC+ 450K 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
APA450-FG896A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:Automotive-Grade ProASIC Flash Family FPGAs
APA450-FGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA450-FGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA450-FGG144 功能描述:IC FPGA PROASIC+ 450K 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
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