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参数资料
型号： APA750-FG896I
厂商： Microsemi SoC
文件页数： 84/178页
文件大小： 0K
描述： IC FPGA PROASIC+ 750K 896-FBGA
标准包装： 27
系列： ProASICPLUS
RAM 位总计： 147456
输入/输出数： 562
门数： 750000
电源电压： 2.3 V ~ 2.7 V
安装类型： 表面贴装
工作温度： -40°C ~ 85°C
封装/外壳： 896-BGA
供应商设备封装： 896-FBGA（31x31）
ProASICPLUS Flash Family FPGAs
4- 6
v5.9
v2.0
(continued)
The following pins have been changed in the "1152-Pin FBGA" table:
Pin Number
Function
Pin Number
Function
U4
I/O (GLMX1)
U29
NPECL2
U6
NPECL1
U31
I/O (GLMX2)
U7
GL1
V28
PPECL2 (I/P)
V5
GL2
V29
GL4
V6
PPECL1 (I/P)
V30
GL3
3-69
Advance v0.7
The "ProASICPLUS Architecture" section was updated.
1-2
The "Array Coordinates" section and Table 2-2 Array Coordinates are new.
2-5
The "Power-Up Sequencing" section is new.
2-7
"I/O Features" section was updated.
2-6
The "Timing Control and Characteristics" section was updated. "Physical Implementation"
section, "Functional Description" section, "Lock Signal" section, and "PLL Configuration
Options" section are new.
2-10 to 2-13
"PLL Block – Top-Level View and Detailed PLL Block Diagram" section was updated.
2-11
Figure 2-12 Input Connectors to ProASICPLUS Clock Conditioning Circuitry was updated.
2-12
"Sample Implementations" section, "Adjustable Clock Delay" section, and the "Clock Skew
Minimization" section are new.
2-13
Figure 2-13 Using the PLL 33 MHz In, 133 MHz Outthrough and Figure 2-17 Using the PLL
for Clock Deskewing are new.
2-14 to 2-16
The "PLL Electrical Specifications" section is new.
2-18
The "Design Environment" section was updated.
2-25
Figure 2-23 Tristate Buffer Delays was updated.
2-42
The "Calculating Typical Power Dissipation" section was updated.
2-28
The "DC Electrical Specifications (VDDP = 2.5 V ±0.2V)" section was updated.
2-34
The Table 2-24 DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)
Applies to Military Temperature and MIL-STD-883B Temperature Only was updated.
2-38
The "DC Specifications (3.3 V PCI Operation)1" section was updated.
2-40
The "Tristate Buffer Delays" section (the figure and table) have been updated.
2-42
The "Output Buffer Delays" section (the figure and table) have been updated.
2-44
The "Input Buffer Delays" section was updated.
2-46
The "Global Input Buffer Delays" section was updated.
2-48
The "Predicted Global Routing Delay" section was updated.
2-50
The "Global Routing Skew" section was updated.
2-50
The "Sample Macrocell Library Listing" section was updated.
2-51
The "Pin Description" section was updated. GLMX is new.
2-73
The "Recommended Design Practice for VPN/VPP" section was updated.
2-74
Pin AK31 of FG1152 for the APA1000 changed to VPP.
3-69
Advance v0.6
The "Features and Benefits" section were updated.
i
The "ProASICPLUS Product Profile" section was updated.
i
The "Ordering Information" section was updated.
ii
The "Plastic Device Resources" was updated.
ii
The "ProASICPLUS Architecture" section was updated.
1-2
Table 2-1 Clock Spines was updated.
2-4
Figure 2-11 PLL Block – Top-Level View and Detailed PLL Block Diagram was updated.
2-11
The "Design Environment" section was updated.
2-25
The "Package Thermal Characteristics" section was updated.
2-27
Previous version
Changes in current version (v5.9)
Page
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参数描述
APA750-FGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA750-FGG676 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA750-FGG676I 功能描述:IC FPGA PROASIC+ 750K 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
APA750-FGG896 功能描述:IC FPGA PROASIC+ 750K 896-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASICPLUS 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
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