参数资料
型号: APEK4986SLP-01-T
厂商: Allegro Microsystems Inc
文件页数: 9/17页
文件大小: 0K
描述: Board Eval Motor Control A4986
标准包装: 1
主要目的: 电源管理,电机控制,步进控制器
嵌入式:
已用 IC / 零件: A4986
已供物品:
相关产品: 620-1342-2-ND - IC PWM MOTOR DRIVER 24TSSOP
其它名称: 620-1376
A4986
DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
Application Layout
Layout . The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A4986 must be soldered directly onto the board. On the under-
side of the A4986 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A4986, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, R Sx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the R Sx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
OUT2B
PCB
Thermal Vias
A4986
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
GND
C5
ROSC
C4
C3
U1
GND
C6
R4
R5
GND
OUT2A
OUT1A
C3
C4
C5
CP1
CP2
VCP
VREG
INO2
A4986
PAD
GND
PH2
OUT2B
VBB2
SENSE2
OUT2A
R4
C6
C1
GND
GND
GND
GND
OUT1B
C1
ROSC
IN12
IN11
ROSC
SLEEP
VDD
IN01
OUT1A
SENSE1
VBB1
OUT1B
PH1
R5
C2
BULK
CAPACITANCE
GND
V DD
REF
GND
V BB
C2
VDD
VBB
LP package configuration
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
9
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