参数资料
型号: APGRD001
厂商: Microchip Technology
文件页数: 10/12页
文件大小: 0K
描述: REF DESIGN PKE PIC16F639
标准包装: 1
类型: PKE,RKE
频率: 125kHz
适用于相关产品: PIC16F639,PIC16F636,PIC18F2680
已供物品: 遥控钥匙、基站和接收器/解码器
LOW POWER ANALOG SOLUTIONS FOR AUTOMOTIVE APPLICATIONS
Solutions for Connectivity Applications
Connectivity within the vehicle is dominated today by two
main network protocols: CAN (Controller Area Network) and
LIN (Local Interconnect Network). CAN utilizes a robust,
high-speed protocol, usually linking major nodes or
subsystems within the vehicle, such as ABS, airbag,
powertrain and suspension control modules. LIN is a low-
speed, single-wire network that usually links nodes within
a vehicle subsystem, such as body electronics, headlight
controls and occupant detection.
Simple Sensor Node Using MCP2515 Standalone CAN Controller
CAN
Bus
LDO
8/16-bit PIC ?
Microcontroller
16-bit dsPIC ? DSC
Op
Sensor
Amp
Motor Control Node Using MCP201 LIN Transceiver
CAN
Controller
CAN
Transceiver
LIN
Bus
LIN + LDO
V DD
8/16-bit PIC ?
Microcontroller
16-bit dsPIC ? DSC
MOSFET
Driver
Motor
Recommended Interface Product Families for Connectivity Applications
Family
CAN Controller
CAN Transceiver
CAN I/O Expander
LIN Transceiver
Features
CAN V2.0B at 1Mb/s, two receive buffers, three transmit buffers high-speed
SPI (10 MHz)
Implements ISO 11898-2 physical layer requirements, ±40V short-circuit
protection, ±250V transient protection
CAN V2.0B, eight general purpose I/Os, four 10-bit A/D converters, two
10-bit PWM outputs
Integrated LDO regulator (5V ±5%), supports LIN rates up to 20 Kbaud,
Device Examples
MCP2515
MCP2551X
MCP25020/25/50/55
MCP201
short-circuit and thermal overload protection
Development Tools
Part Number
DM163005
DM163007, DM163011, DM163015
DV250501
DV251001
MCP2515DM-PCTL
SOIC8EV
Product
PICDEM? LIN Demonstration Board
PICDEM? CAN-LIN 1, 2 and 3 Demonstration Boards
MCP250XX CAN I/O Expander Developer’s Kit
MCP2510/2515 CAN Developer’s Kit
MCP2515 CAN Controller PICtail? Demonstration Board
SOIC 8-Lead Evaluation Board
10
Automotive Applications Design Guide
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