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| 型号： | ARD00342 |
| 厂商： | Microchip Technology |
| 文件页数： | 17/30页 |
| 文件大小： | 0K |
| 描述： | BOARD REF DESIGN MCP3901 |
| 设计资源： | ARD00342 Bill of Materials ARD00342 Schematic |
| 标准包装： | 1 |
| 主要目的： | 电源管理，电度表/功率表 |
| 嵌入式： | 是，MCU，8 位 |
| 已用 IC / 零件： | MCP3901，PIC18F65J90 |
| 主要属性： | 单相分流电度表 |
| 次要属性： | USB 接口 |
| 已供物品： | 板，线缆 |
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PCA2002
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 8 — 25 November 2011
24 of 30
NXP Semiconductors
PCA2002
32 kHz watch circuit with programmable output period and pulse width
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 17.
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
Table 17.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
MSL: Moisture Sensitivity Level
Fig 17. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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