参数资料
型号: ARXP1012
厂商: Panasonic Electric Works
文件页数: 4/5页
文件大小: 0K
描述: RELAY RF SPDT 500MA 12V
其它有关文件: Standards Chart
产品变化通告: RX, RX-P Relays Discontinuation Mar/2012
产品目录绘图: ARX(P) Series
ARX(P) Series Footprint
ARX(P) Series Circuit
标准包装: 50
系列: ARXP
继电器类型: RF
线圈类型: 无锁存
线圈电流: 16.7mA
线圈电压: 12VDC
触点形式: SPDT(1 C 型)
触点额定值(电流): 500mA
切换电压: 30VDC - 最小值
关闭电压(最大): 9 VDC
关闭电压(最小): 1.2 VDC
安装类型: 通孔
端接类型: PC 引脚
包装: 管件
触点材料: 镀金
操作时间: 10ms
释放时间: 6ms
线圈功率: 200 mW
线圈电阻: 720 欧姆
工作温度: -40°C ~ 70°C
产品目录页面: 2598 (CN2011-ZH PDF)
其它名称: 255-2719

RX-P (ARXP1)
DIMENSIONS (mm inch )
External dimensions
Part No.
PC board pattern (Bottom view)
0.9 dia. hole
.035 dia. hole
12.4
.488
Lot No.
7.62
.300
2.54
.100
2.54
.100
2 coil latching only
20.5
.807
9.2
.362
0.2
.008
3.0
.118
0.90
.035
R 0.45 .018
Tolerance: ± 0.1 ± .004
2.63
.104
2.54
.100
(2.04)
(.080)
7.62
.300
(2.74)
(.108)
2-0.6 × 0.3
2-.024 × .012
Schematic (Bottom view)
Solder to the
Single side stable
1 coil latching
2 coil latching
PC board earth.
- 1
+ 7
+ 1
- 7
1
6
7
-
+ +
7-0.40 to 0.45 dia.
7-.016 to .018 dia.
14 13 12 11 10
9
8
14 13 12 11 10
9
8
14 13 12 11 10
9
8
Tolerance: ± 0.3 ± .012
NC
COM
NO
RESET
COM
SET
RESET
COM
SET
NOTES
(Deenergized condition)
(Reset condition)
(Reset condition)
1. Coil operating power
Pure DC current should be applied to the
coil. The wave form should be
rectangular. If it includes ripple, the ripple
factor should be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different.
2. Coil connection
When connecting coils, refer to the wiring
diagram to prevent mis-operation or
malfunction.
To ensure accurate operation, the voltage
on both sides of the coil should be ± 5%
(at 20 ° C 68 ° F ) of the nominal coil
voltage.
Also, please note that the pick-up and
drop-out voltages (set and reset voltages)
will change depending on operation
temperature and conditions of use.
Keep the coil allowable voltage ripple
ratio to no more than 5%.
3. External magnetic ?eld
Since RX-P relays are highly sensitive
polarized relays, their characteristics will
be affected by a strong external magnetic
?eld. Avoid using the relay under that
condition.
4. Cleaning
For automatic cleaning, the boiling
method is recommended. Avoid
ultrasonic cleaning which subjects the
relays to high frequency vibrations, which
may cause the contacts to stick.
It is recommended that alcoholic solvents
be used.
5. Soldering
1) Please meet the following conditions if
this relay is to be automatically soldered.
(1) Preheating: Max. 120 ° C 248 ° F
(terminal solder surface) for max. 120
seconds
(2) Soldering: Max. 260 ± 5 ° C 500 ± 41 ° F
for max. 6 seconds
2) Please meet the following conditions if
this relay is to be soldered by hand.
(1) 260 ° C 500 ° F for max. 10 seconds
(2) 350 ° C 662 ° F for max. 3 seconds
*In addition, when soldering the case to
the PC board, the plating may swell
depending on the soldering conditions.
6. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and
atmospheric pressure during usage,
transport, and storage of the relay:
(1) Temperature:
–40 to +70 ° C –40 to +158 ° F (However,
when 60 to 70 ° C 140 to 158 ° F , the pulse
time is 1 second maximum and ON time
is 10% maximum.)
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the
temperature. Use within the range
indicated in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for
usage, transport, and storage:
Humidity, %R.H.
85
Tolerance range
(Avoid freezing (Avoid
when used at condensation
temperatures when used at
lower than temperatures
0 ° C 32 ° F ) higher than
0 ° C 32 ° F )
5
-40 0 70
-40 32 158
Temperature, ° C ° F
2) Condensation
Condensation forms when there is a
sudden change in temperature under
high temperature and high humidity
conditions. Condensation will cause
deterioration of the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0 ° C 32 ° F . This causes
problems such as sticking of movable
parts or operational time lags.
4) Low temperature, low humidity
environments
The plastic becomes brittle if the relay is
exposed to a low temperature, low
humidity environment for long periods of
time.
ASCTB7 5 E 201201-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e
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