参数资料
型号: AS1112 EB
厂商: ams
文件页数: 4/20页
文件大小: 0K
描述: BOARD EVAL AS1112
标准包装: 1
电流 - 输出 / 通道: 0.5 ~ 100 mA
输出及类型: 16,非隔离
输出电压: 0 ~ 15 V
特点: 过热保护,开路 LED,短路 LED,诊断
输入电压: 3 ~ 5.5 V
已供物品:
已用 IC / 零件: AS1112
AS1112
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Recommended Operating Conditions on page 4 is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
Electrical Parameters
VCC to GND
All other pins to GND
VOUT0 : VOUT15 to GND
Output Current (DC)
-0.3
-0.3
-0.3
6
V CC + 0.3
15
110
V
V
V
mA
Input Current (latch-up immunity)
-100
100
mA
Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM
+/- 2
kV
Norm: MIL 883 E method 3015
Thermal Information
Junction to ambient thermal resistance
37
°C/W
For more information about thermal metrics, see
application note AN01 Thermal Characteristics.
Temperature Ranges and Storage Conditions
Junction Temperature
+110
oC
Storage Temperature Range
-55
+150
oC
The reflow peak soldering temperature (body temperature)
specified is in accordance with IPC/JEDEC J-STD-
Package Body Temperature
+260
oC
020“Moisture/Reflow Sensitivity Classification for Non-
Hermetic Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
Humidity non-condensing
5
85
%
Moisture Sensitive Level
3
Revision 1.13
Represents a max. floor life time of 168h
3 - 19
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