参数资料
型号: AS1334-BTDT
厂商: ams
文件页数: 4/19页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 0.65A 8TDFN
设计资源: Design Support Tool
标准包装: 1,000
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 1.2 V ~ 3.4 V
输入电压: 2.7 V ~ 5.5 V
PWM 型: 电流模式
频率 - 开关: 2MHz
电流 - 输出: 650mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-WDFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 8-TDFN(3x3)
AS1334
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Electrical Parameters
VDD, PVIN to SGND
PGND to SGND
-0.3
-0.3
+7.0
+0.3
V
V
POK, EN, FB
SW
PVIN to VDD
Input Voltage Range
Recommended Load Current
Ambient Temperature (T A ) Range
SGND - 0.3
PGND - 0.3
-0.3
2.7
-40
VDD + 0.3
PVIN + 0.3
+0.3
5.5
650
+85
V
V
V
V
mA
oC
7.0V max
In applications where high power dissipation and/
or poor package thermal resistance is present,
the maximum ambient temperature may have to
be derated.
Maximum ambient temperature (T A-MAX ) is
dependent on the maximum operating junction
temperature (T J-MAX-OP = 125oC), the maximum
power dissipation
of the device in the application (P D-MAX ), and the
junction-to ambient thermal resistance of the
part/package in the application ( θ JA ), as given by
the following
equation: T A-MAX = T J-MAX-OP – ( θ JA × P D-MAX ).
Electrostatic Discharge
Human Body Model
2
kV
Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Junction Temperature (T J-MAX )
+150
oC
Storage Temperature Range
-55
+150
oC
Package Body Temperature
+260
oC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity
5
86
%
Non-condensing
Moisture Sensitive Level
1
Revision 1.09
Represents a max. floor life time of unlimited
3 - 18
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