参数资料
型号: AT24C08B-TH-T
厂商: Atmel
文件页数: 21/28页
文件大小: 0K
描述: IC EEPROM 8KBIT 1MHZ 8TSSOP
产品变化通告: AT24C04,08B Obsolescence 04/Nov/2011
标准包装: 5,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 8K (1K x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)

Two-wire Serial EEPROM
12.
Packaging Information
8P3 – PDIP
Figure 15.
8P3 – PDIP
1
E
E1
N
Top View
c
eA
End View
D
e
COMMON DIMENSIONS
(Unit of Measure = inches)
D1
A2 A
SYMBOL
A
MIN
NOM
MAX
0.210
NOTE
2
A2
0.115
0.130
0.195
b
b2
b3
c
D
0.014
0.045
0.030
0.008
0.355
0.018
0.060
0.039
0.010
0.365
0.022
0.070
0.045
0.014
0.400
5
6
6
3
b2
L
D1
0.005
3
b3
4 PLCS
b
E
E1
0.300
0.240
0.310
0.250
0.325
0.280
4
3
Side View
e
eA
0.100 BSC
0.300 BSC
4
L
0.115
0.130
0.150
2
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
R
2325 Orchard Parkway
San Jose, CA 95131
8P3 , 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
21
5226G–SEEPR–11/09
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