参数资料
型号: AT24C08B-TH-T
厂商: Atmel
文件页数: 25/28页
文件大小: 0K
描述: IC EEPROM 8KBIT 1MHZ 8TSSOP
产品变化通告: AT24C04,08B Obsolescence 04/Nov/2011
标准包装: 5,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 8K (1K x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)
Two-wire Serial EEPROM
5TS1 – SOT23
Figure 19.
5TS1 – SOT23
e1
L
E1
5
4
E
C
C
L1
Seating
1
2
Top View
b
3
A2
A
End View
Plane
e
D
Side View
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
NOTES: 1. This d rawing is for gene ral information onl y. Refer to JEDEC D rawing
MO-193, Variation A B, for additional in formation.
2. Dimension D does not include mold flash, prot rusion s, or gate burrs.
Mold flash, prot rusion s, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include inte rlead flash or prot rusion . Inte rlead
flash or prot rusion shall not exceed 0.15 mm per sid e.
3. The pa ckage top m ay be smaller than the pa ckage bottom . Dimensions
D and E1 are dete rmined at the oute rmost extremes of the plastic body
exclusi ve of mold flash, tie bar burrs, gate burrs, and inte rlead flash, but
including a ny mismatch bet ween the top and bottom of the plastic bod
y.
4. These dimensions apply to the flat section of the lead bet
ween 0.08 mm
and 0.15 mm from the lead ti p.
SYMBOL
A
A1
A2
c
D
E
E1
MIN
0.00
0.70
0.08
NOM
0.90
2.90 BS C
2.80 BS C
1.60 BS C
MAX
1.10
0.10
1.00
0.20
NOTE
4
2, 3
2, 3
2, 3
5. Dimension "b" does not include Dambar prot rusion . Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maxi mum mate rial condition . The Dambar cannot be located on the l ower
radius of the foot. Mini mum space bet ween prot rusion and an adjacent lead
L1
e
e1
0.60 REF
0.95 BSC
1.90 BSC
shall not be less than 0.07 mm.
b
0.30
0.50
4, 5
6/25/03
1150 E . Cheyenne Mtn . Blvd.
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
DRAWING NO.
REV.
R
Colorado Sp rings, CO 80906
Small Outline Package (SHRINK SOT)
PO5TS1
A
25
5226G–SEEPR–11/09
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