参数资料
型号: AT24C512-10TU-2.7 SL383
厂商: Atmel
文件页数: 13/22页
文件大小: 0K
描述: IC EEPROM 512KBIT 1MHZ 8TSSOP
标准包装: 5,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 512K (64K x 8)
速度: 400kHz,1MHz
接口: I²C,2 线串口
电源电压: 2.7 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)
其它名称: AT24C51210TU27SL3
AT24C512
Ordering Information (1)
AT24C512C1-10CU-2.7
Ordering Code
(2)
AT24C512C1-10CU-1.8 (2)
AT24C512-10PU-2.7 (2)
AT24C512-10PU-1.8 (2)
AT24C512W-10SU-2.7 (2)
AT24C512W-10SU-1.8 (2)
AT24C512N-10SU-2.7 (2)
AT24C512N-10SU-1.8 (2)
AT24C512-10TU-2.7 (2)
AT24C512-10TU-1.8 (2)
AT24C512Y4-10YU-1.8 (2)
AT24C512U4-10UU-1.8 (2)
AT24C512-W1.8-11 (3)
Package
8CN1
8CN1
8P3
8P3
8S2
8S2
8S1
8S1
8A2
8A2
8Y4
8U4-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40 ° C to 85 ° C)
Industrial Temperature
(–40 ° C to 85 ° C)
Notes:
8CN1
8P3
8S2
8S1
8A2
8Y4
8U4-1
–2.7
–1.8
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM marketing.
Package Type
8-lead, 0.300" Wide, Leadless Array Package (LAP)
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 3.6V)
13
1116O–SEEPR–1/07
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AT24C512BN-SH25-B 功能描述:电可擦除可编程只读存储器 512K 2-WIRE 65 536 x 8 2.5V RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8