参数资料
型号: AT89C51AC3-RDTIM
厂商: Atmel
文件页数: 52/140页
文件大小: 0K
描述: IC 8051 MCU FLASH 64K 64VQFP
标准包装: 160
系列: 89C
核心处理器: 8051
芯体尺寸: 8-位
速度: 60MHz
连通性: SPI,UART/USART
外围设备: POR,PWM,WDT
输入/输出数: 36
程序存储器容量: 64KB(64K x 8)
程序存储器类型: 闪存
EEPROM 大小: 2K x 8
RAM 容量: 2.25K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
数据转换器: A/D 8x10b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 64-LQFP
包装: 托盘
2009 Microchip Technology Inc.
DS70286C-page 17
dsPIC33FJXXXGPX06/X08/X10
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
2.1
Basic Connection Requirements
Getting
started
with
the
dsPIC33FJXXXGPX06/X08/X10 family of 16-bit Digital
Signal Controllers (DSCs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
All VDD and VSS pins
All AVDD and AVSS pins (regardless if ADC module
is not used)
VCAP/VDDCORE
MCLR pin
PGECx/PGEDx pins used for In-Circuit Serial
Programming (ICSP) and debugging purposes
OSC1 and OSC2 pins when external oscillator
source is used
Additionally, the following pins may be required:
VREF+/VREF- pins used when external voltage
reference for ADC module is implemented
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as VDD, VSS, AVDD and
AVSS is required.
Consider the following criteria when using decoupling
capacitors:
Value and type of capacitor: Recommendation
of 0.1 F (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 F in parallel with 0.001 F.
Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note:
This data sheet summarizes the features
of the dsPIC33FJXXXGPX06/X08/X10
family of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the “dsPIC33F Family
Reference Manual”, which is available
Note:
The AVDD and AVSS pins must be
connected independent of the ADC
voltage reference source.
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