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参数资料
| 型号： | AT93C86AY6-10YH-1.8 |
| 厂商： | Atmel |
| 文件页数： | 12/18页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 16KBIT 2MHZ 8MAP |
| 标准包装： | 1 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 16K（2K x 8 或 1K x 16） |
| 速度： | 250kHz，1MHz，2MHz |
| 接口： | Microwire 3 线串行 |
| 电源电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-UDFN 裸露焊盘 |
| 供应商设备封装： | 8-MLP（2x3） |
| 包装： | 标准包装 |
| 其它名称： | AT93C86AY6-10YH-1.8DKR |
Packaging Information
8P3 – PDIP
1
E
E1
N
Top View
c
eA
End View
D
e
COMMON DIMENSIONS
(Unit of Measure = inches)
D1
A2 A
SYMBOL
MIN
NOM
MAX
NOTE
A
0.210
2
A2
0.115
0.130
0.195
b
b2
b3
c
D
0.014
0.045
0.030
0.008
0.355
0.018
0.060
0.039
0.010
0.365
0.022
0.070
0.045
0.014
0.400
5
6
6
3
b2
L
D1
0.005
3
b3
4 PLCS
b
E
E1
0.300
0.240
0.310
0.250
0.325
0.280
4
3
Side View
e
eA
0.100 BSC
0.300 BSC
4
L
0.115
0.130
0.150
2
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE
DRAWING NO.
REV.
R
2325 Orchard Parkway
San Jose, CA 95131
8P3 , 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
8P3
B
12
AT93C86A
3408H–SEEPR–1/07
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