参数资料
型号: ATMEGA324PA-CU
厂商: Atmel
文件页数: 133/160页
文件大小: 0K
描述: MCU AVR 32K FLASH 20MHZ BGA
产品培训模块: MCU Product Line Introduction
megaAVR Introduction
标准包装: 525
系列: AVR® ATmega
核心处理器: AVR
芯体尺寸: 8-位
速度: 20MHz
连通性: I²C,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 32KB(16K x 16)
程序存储器类型: 闪存
EEPROM 大小: 1K x 8
RAM 容量: 2K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 5.5 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 49-VFBGA
包装: 托盘
配用: ATSTK600-ND - DEV KIT FOR AVR/AVR32
74
8272E–AVR–04/2013
ATmega164A/PA/324A/PA/644A/PA/1284/P
If PORTxn is written logic one when the pin is configured as an output pin, the port pin is driven
high (one). If PORTxn is written logic zero when the pin is configured as an output pin, the port
pin is driven low (zero).
14.2.2
Toggling the pin
Writing a logic one to PINxn toggles the value of PORTxn, independent on the value of DDRxn.
Note that the SBI instruction can be used to toggle one single bit in a port.
14.2.3
Switching between input and output
When switching between tri-state ({DDxn, PORTxn} = 0b00) and output high ({DDxn, PORTxn}
= 0b11), an intermediate state with either pull-up enabled {DDxn, PORTxn} = 0b01) or output
low ({DDxn, PORTxn} = 0b10) must occur. Normally, the pull-up enabled state is fully accept-
able, as a high-impedant environment will not notice the difference between a strong high driver
and a pull-up. If this is not the case, the PUD bit in the MCUCR Register can be set to disable all
pull-ups in all ports.
Switching between input with pull-up and output low generates the same problem. The user
must use either the tri-state ({DDxn, PORTxn} = 0b00) or the output high state ({DDxn, PORTxn}
= 0b11) as an intermediate step.
Table 14-1 summarizes the control signals for the pin value.
14.2.4
Reading the Pin Value
Independent of the setting of Data Direction bit DDxn, the port pin can be read through the
PINxn Register bit. As shown in Figure 14-2, the PINxn Register bit and the preceding latch con-
stitute a synchronizer. This is needed to avoid metastability if the physical pin changes value
near the edge of the internal clock, but it also introduces a delay. Figure 14-3 shows a timing dia-
gram of the synchronization when reading an externally applied pin value. The maximum and
minimum propagation delays are denoted t
pd,max and tpd,min respectively.
Table 14-1.
Port pin configurations.
DDxn
PORTxn
PUD
(in MCUCR)
I/O
Pull-up
Comment
0
X
Input
No
Tri-state (Hi-Z)
0
1
0
Input
Yes
Pxn will source current if ext. pulled low.
0
1
Input
No
Tri-state (Hi-Z)
1
0
X
Output
No
Output Low (Sink)
1
X
Output
No
Output High (Source)
相关PDF资料
PDF描述
ATSAM3N4BA-MU MCU FLASH 64-QFN
ATSAM3N1AA-MU MCU FLASH 48-QFN
ATUC64D4-Z1UT IC MCU 32BIT 64KB FLASH 48QFN
ATUC64D4-AUT IC MCU 32BIT 64KB FLASH 48TQFP
AT91SAM7S32B-AU IC MCU ARM7 32KB FLASH 48LQFP
相关代理商/技术参数
参数描述
ATMEGA324PA-CUR 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz IND RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-D 功能描述:8位微控制器 -MCU AVR 32KB 1KB EE 20MHz 2KB SRAM 5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-MCH 功能描述:8位微控制器 -MCU AVR 32KB 1KB EE 20MHz 2KB SRAM 5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-MCHR 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz IND RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
ATMEGA324PA-MN 功能描述:8位微控制器 -MCU AVR 32KB FLSH 1KB EE 2KB SRAM-20MHz 105C RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT