参数资料
型号: AXK6S70547YG
厂商: Panasonic Electric Works
文件页数: 13/15页
文件大小: 0K
描述: CONN HEADER BRD/BRD .5MM 70POS
其它有关文件: Connectors SMD-Technical Info
标准包装: 1,000
系列: P5KS
连接器类型: 接头,外罩触点
位置数: 70
间距: 0.020"(0.50mm)
行数: 2
安装类型: 表面贴装
触点表面涂层:
包装: 带卷 (TR)
配接层叠高度: 5mm,5.5mm,8mm
板上方高度: 0.169"(4.30mm)
配套产品: 255-3237-1-ND - CONN SOCKET BRD/BRD .5MM 70POS
AXK5S70347YG-ND - CONN SOCKET BRD/BRD .5MM 70POS
AXK5S70337YG-ND - CONN SOCKET BRD/BRD .5MM 70POS
AXK5S70247YG-ND - CONN SOCKET BRD/BRD .5MM 70POS
AXK5S70237YG-ND - CONN SOCKET BRD/BRD .5MM 70POS
255-3237-2-ND - CONN SOCKET BRD/BRD .5MM 70POS
AXK5S70037YG-ND - CONN SOCKET BRD/BRD .5MM 70POS
Notes on Using Narrow pitch Connectors
Regarding soldering
1. Re?ow soldering
1) Measure the recommended pro?le
temperature for re?ow soldering by
placing a sensor on the PC board near
Soldering conditions
Please use the re?ow temperature pro?le
conditions recommended below for
re?ow soldering. Please contact us
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
before using a temperature pro?le other
than that described below (e.g. lead-free
solder).
? Narrow pitch connectors
(except P8 type)
Table A
Product name
SMD type connectors
Soldering iron temperature
300 ° C within 5 sec.
350 ° C within 3 sec.
2) As for cream solder printing, screen
printing is recommended.
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
2) Do not allow ?ux to spread onto the
connector leads or PC board. This may
200 ° C
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
Temperature
Peak temperature 260 ° C
230 ° C
180 ° C
Peak temperature
220 ° C
Preheating
lead to ?ux rising up to the connector
inside.
3) Touch the soldering iron to the foot
diagrams in the recommended patterns
for PC boards and metal masks. Make
150 ° C
60 to 120 sec.
25 sec.
70 sec.
pattern. After the foot pattern and
connector terminal are heated, apply the
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
? Narrow pitch connector (P8)
Time
solder wire so it melts at the end of the
connector terminals.
otherwise, interference by the solder will
cause an imperfect contact.
Temperature
245 ° C max.
Peak temperature
200 ° C
Apply the solder
wire here
Terminal
Paste
solder
155 to 165 ° C
Preheating
60 to 120 sec.
Within 30 sec.
Terminal
Small angle as
possible up to
45 degrees
PC board
Time
foot pattern
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly ?xed to the PC board. (Double
re?ow soldering on the same side is
possible.)
6) N 2 re?ow, conducting re?ow soldering
in a nitrogen atmosphere, increases the
solder ?ow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature pro?le are
appropriate.
For products other than the ones above,
please refer to the latest product
speci?cations.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature pro?les given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed re?ow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and ?ux types may
cause serious solder or ?ux creeping.
Solder and ?ux characteristics should be
taken into consideration when setting the
re?ow soldering conditions.
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a ?at tip. To prevent
?ux from climbing up to the contact
surfaces, do not add more ?ux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T
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