参数资料
型号: B32526R1156K
厂商: EPCOS Inc
文件页数: 39/45页
文件大小: 0K
描述: FILM CAP 15UF 10% 100V
标准包装: 405
系列: B32526
电容: 15µF
额定电压 - AC: *
额定电压 - DC: *
电介质材料: 聚酯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -55°C ~ 125°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.634" L x 0.472" W(41.50mm x 12.00mm)
高度 - 座高(最大): 0.866"(22.00mm)
端子: PC 引脚
引线间隔: 1.476"(37.50mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32526R1156K000
B32520 ... B32529
General purpose (stacked/wound)
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Important notes
at the end of this document.
Page 39 of 45
相关PDF资料
PDF描述
M2011B2B3W01 SW TOGGLE SPST THR SLV SLD LUG
IXFK44N50Q MOSFET N-CH 500V 44A TO-264AA
B32796E4755K FILM CAP 7.5UF 10% 400V MKP
AX-24.576MAGV-T CRYSTAL 24.576 MHZ 8 PF SMD
S39 SW TOGGLE 3PDT 15A SOLDER
相关代理商/技术参数
参数描述
B32526R1156K000 功能描述:CAP FILM 15UF 10% 100VDC RADIAL 制造商:epcos (tdk) 系列:B32526 包装:散装 零件状态:在售 电容:15μF 容差:±10% 额定电压 - AC:63V 额定电压 - DC:100V 介电材料:聚酯,聚对苯二甲酸乙二醇酯(PET),金属化 工作温度:-55°C ~ 125°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.634" 长 x 0.472" 宽(41.50mm x 12.00mm) 高度 - 安装(最大值):0.866"(22.00mm) 端接:PC 引脚 引线间距:1.476"(37.50mm) 应用:汽车级;EMI、RFI 抑制 等级:- 特性:- 标准包装:1,620
B32526R1157 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)
B32526R1157K 功能描述:薄膜电容器 Film Cap 150UF 10% 100V MKT BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32526R1157K000 功能描述:CAP FILM 150UF 10% 100VDC RADIAL 制造商:epcos (tdk) 系列:B32526 包装:散装 零件状态:在售 电容:150μF 容差:±10% 额定电压 - AC:63V 额定电压 - DC:100V 介电材料:聚酯,聚对苯二甲酸乙二醇酯(PET),金属化 工作温度:-55°C ~ 125°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:1.634" 长 x 1.102" 宽(41.50mm x 28.00mm) 高度 - 安装(最大值):1.673"(42.50mm) 端接:PC 引脚 引线间距:1.476"(37.50mm) 应用:汽车级;EMI、RFI 抑制 等级:- 特性:- 标准包装:440
B32526R1226 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)