参数资料
型号: B32776G8306K
厂商: EPCOS Inc
文件页数: 13/21页
文件大小: 0K
描述: CAP FILM 30UF 800VDC RADIAL
产品培训模块: Film Capacitors
产品目录绘图: B32zzz(D,E,T) Series Side 1
B32zzz(D,E,T) Series Side 2
特色产品: B3277 High Density Series Film Capacitors
标准包装: 100
系列: B32776
电容: 30µF
额定电压 - DC: 800V
电介质材料: 聚丙烯,金属化
容差: ±10%
ESR(等效串联电阻): 3.5 毫欧
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 1.654" L x 1.181" W(42.00mm x 30.00mm)
高度 - 座高(最大): 1.772"(45.00mm)
端子: PC 引脚
引线间隔: 1.476"(37.50mm)
特点: 通用
包装: 散装
产品目录页面: 2060 (CN2011-ZH PDF)
其它名称: 495-3940
B32774 ... B32778
Mounting guidelines
MKP DC link
high density series
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 21
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