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参数资料
| 型号： | B32776G8306K |
| 厂商： | EPCOS Inc |
| 文件页数： | 15/21页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 30UF 800VDC RADIAL |
| 产品培训模块： | Film Capacitors |
| 产品目录绘图： | B32zzz(D,E,T) Series Side 1 B32zzz(D,E,T) Series Side 2 |
| 特色产品： | B3277 High Density Series Film Capacitors |
| 标准包装： | 100 |
| 系列： | B32776 |
| 电容： | 30µF |
| 额定电压 - DC： | 800V |
| 电介质材料： | 聚丙烯，金属化 |
| 容差： | ±10% |
| ESR（等效串联电阻）： | 3.5 毫欧 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 1.654" L x 1.181" W（42.00mm x 30.00mm） |
| 高度 - 座高（最大）： | 1.772"（45.00mm） |
| 端子： | PC 引脚 |
| 引线间隔： | 1.476"（37.50mm） |
| 特点： | 通用 |
| 包装： | 散装 |
| 产品目录页面： | 2060 (CN2011-ZH PDF) |
| 其它名称： | 495-3940 |
B32774 ... B32778
MKP DC link
high density series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature T max . Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommends the following conditions:
Pre-heating with a maximum temperature of 110 ° C
Temperature inside the capacitor should not exceed the following limits:
MKP/MFP 110 ° C
MKT 160 ° C
When SMD components are used together with leaded ones, the leaded film capacitors should
not pass into the SMD adhesive curing oven. The leaded components should be assembled af-
ter the SMD curing step.
Leaded film capacitors are not suitable for reflow soldering.
Uncoated capacitors
For uncoated MKT capacitors with lead spacings ≤ 10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 ° C in the preheater phase
rapid cooling after soldering
Please read Cautions and warnings and
Important notes at the end of this document.
Page 15 of 21
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