参数资料
型号: B32778G1256K
厂商: EPCOS Inc
文件页数: 13/21页
文件大小: 0K
描述: FILM CAP 25UF 10% 1300V MKP
标准包装: 27
系列: B32778
电容: 25µF
额定电压 - DC: 1300V(1.3kV)
电介质材料: 聚丙烯,金属化
容差: ±10%
ESR(等效串联电阻): *
工作温度: -40°C ~ 105°C
安装类型: 通孔
封装/外壳: 径向
尺寸/尺寸: 2.264" L x 1.378" W(57.50mm x 35.00mm)
高度 - 座高(最大): 1.969"(50.00mm)
端子: PC 引脚
引线间隔: 2.067"(52.50mm)
特点: 通用
应用: *
包装: 散装
其它名称: B32778G1256K000
B32774 ... B32778
Mounting guidelines
MKP DC link
high density series
1
1.1
Soldering
Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 ° C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature
Soldering time
Immersion depth
Evaluation criteria:
Visual inspection
235 ± 5 ° C
2.0 ± 0.5 s
2.0 +0/ 0.5 mm from capacitor body or seating plane
Wetting of wire surface by new solder 90%, free-flowing solder
1.2
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A.
Conditions:
Serie s
Solder bath temperature Soldering time
MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ± 5 ° C
coated
uncoated (lead spacing > 10 mm)
MFP
MKP (lead spacing > 7.5 mm)
MKT boxed (case 2.5 × 6.5 × 7.2 mm)
MKP (lead spacing ≤ 7.5 mm)
MKT uncoated (lead spacing ≤ 10 mm)
insulated (B32559)
10 ± 1 s
5 ± 1 s
<4s
recommended soldering
profile for MKT uncoated
(lead spacing ≤ 10 mm) and
insulated (B32559)
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 21
相关PDF资料
PDF描述
GWM160-0055X1-SL SAM IC FULL BRIDGE 3PH ISOPLUS STRT
FXO-PC738-669.3266 OSC 669.3266 MHZ 3.3V PECL SMD
IXFH74N20P MOSFET N-CH 200V 74A TO-247
AA-25.000MALE-T CRYSTAL 25.000 MHZ 12 PF SMD
FXO-PC738-672.162712 OSC 672.162712 MHZ 3.3V PECL SMD
相关代理商/技术参数
参数描述
B32778G1256K000 功能描述:薄膜电容器 25UF 10% 1300V FILM CAP MKP BOXED RoHS:否 制造商:Cornell Dubilier 产品类型: 电介质:Polyester 电容:0.047 uF 容差:10 % 电压额定值:100 V 系列:225P 工作温度范围:- 55 C to + 85 C 端接类型:Radial 引线间隔:9.5 mm
B32778G1276 制造商:EPCOS 制造商全称:EPCOS 功能描述:Film Capacitors Metallized Polyester Film Capacitors (MKT)
B32778G1276+000 制造商:EPCOS 制造商全称:EPCOS 功能描述:Metallized Polypropylene Film Capacitors (MKP)
B32778G1276J 功能描述:FILM CAP 27UF 5% 1300V MKP RoHS:是 类别:电容器 >> 薄膜 系列:B32778 特色产品:ECW-H(C) Series Film Capacitors 标准包装:100 系列:ECW-H(C) 电容:0.33µF 额定电压 - AC:- 额定电压 - DC:630V 电介质材料:聚丙烯,金属化 容差:±3% ESR(等效串联电阻):- 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 尺寸/尺寸:0.815" L x 0.579" W(20.70mm x 14.70mm) 高度 - 座高(最大):1.028"(26.10mm) 端子:PC 引脚 引线间隔:0.394"(10.00mm) 特点:高频和高稳定性 应用:- 包装:散装 其它名称:ECWH6334HCBP15432
B32778G1276J000 功能描述:CAP FILM 27UF 5% 1.3KVDC RADIAL 制造商:epcos (tdk) 系列:B32778 包装:散装 零件状态:在售 电容:27μF 容差:±5% 额定电压 - AC:- 额定电压 - DC:1300V(1.3kV) 介电材料:聚丙烯(PP),金属化 ESR(等效串联电阻):4.5 mOhms 工作温度:-40°C ~ 105°C 安装类型:通孔 封装/外壳:径向 大小/尺寸:2.264" 长 x 1.378" 宽(57.50mm x 35.00mm) 高度 - 安装(最大值):1.969"(50.00mm) 端接:PC 引脚 引线间距:2.067"(52.50mm) 应用:DC 链路,DC 滤波 等级:- 特性:长寿命 标准包装:108