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参数资料
| 型号： | B57261V2223J60 |
| 厂商： | EPCOS Inc |
| 文件页数： | 13/18页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR NTC 22K OHM 5% SMD |
| 产品目录绘图： | NTC Surface Mount Side 1 NTC Surface Mount Side 2 |
| 标准包装： | 1 |
| 系列： | B572**V |
| 在 25°C 时的电阻（欧姆）： | 22k |
| 电阻公差： | ±5% |
| B 值公差： | ±3% |
| B25/50： | 4473K |
| B25/85： | 4548K |
| B25/100： | 4575K |
| 工作温度： | -55°C ~ 125°C |
| 功率 - 最大： | 150mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0402（1005 公制） |
| 包装： | 标准包装 |
| 其它名称： | 495-3041-6 |
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
B572**V2
6
Placement and orientation of SMD NTC thermistors on PCB
a) Component placement
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
b) Cracks
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
c) Component orientation
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 13 of 18
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相关代理商/技术参数 |
参数描述 |
|---|---|
| B57261V2333J 60 | 制造商:TDK-EPC 功能描述:NTC THERMISTOR 0402 33K J60 B-4575 - Tape and Reel |
| B57261V2333J060 | 功能描述:热敏电阻 - NTC 0402 33K J60 B-4575 NTC Thermistor RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
| B57261V2333J60 | 制造商:TDK-EPC 功能描述:Thermistor NTC 33KOhm 5% 2-Pin 0402 Cardboard T/R 制造商:TDK-EPC 功能描述:NTC THERMISTOR 0402 33K J60 |
| B57276K | 制造商:EPCOS 制造商全称:EPCOS 功能描述:NTC thermistors for temperature measurement |
| B57276K 123A 24 | 制造商:TDK Epcos 功能描述:NTC THERMISTOR K 276/12 K/A 24 2% - Bulk |
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