参数资料
型号: BA08CC0WT-TR
元件分类: 固定正电压单路输出LDO稳压器
英文描述: 8 V FIXED POSITIVE LDO REGULATOR, 0.5 V DROPOUT, SFM5
封装: LEAD FREE, TO-220FP, 5 PIN
文件页数: 5/9页
文件大小: 1047K
代理商: BA08CC0WT-TR
5/8
Vcc
CTL
39kΩ
2kΩ
31kΩ
CTL
25kΩ
OUT
R2
R1
Vcc
●Block Diagrams
BA□□CC0WFP/ BA□□DD0WHFP/ BA□□CC0WT(V5)/ BA□□DD0WT
BA□□CC0T/ BA□□CC0FP/ BA□□DD0T
Fig.26
●Input / Output Equivalent Circuit Diagrams
< BA□□DD0 Series >
< BA□□CC0 Series >
Fig.27
Fig.28
●Thermal Design
HRP-5
TO220FP-5
TO252-5
Fig.29
Fig.30
Fig.31
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The IC
characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature TjMAX., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction and
long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures lower than the maximum junction temperature TjMAX of the IC.
PIN No.
Pin Name
Function
1
CTL
Output voltage ON/OFF control
2
Vcc
Power supply voltage input
3
N.C/GND
Unconnected terminal/GND
*
1
4
OUT
Voltage output
5
N.C
Unconnected terminal
Fin
GND
*
2
PIN No.
Pin Name
Function
1
Vcc
Power supply voltage input
2
N.C/GND
Unconnected terminal/GND*
1
3
OUT
Voltage output
Fin
GND
*
2
Fig.25
HRP5
1 2 3 45
TOP VIEW
TO220FP-5
TO220FP-5(V5)
1 2 3 4 5
TOP VIEW
FIN
TO252-5
1 2 3 4 5
10kΩ
OUT
R2
R1
Vcc
GND
1
2
3
4
5
Fin
Vcc
Driver
OVP
TSD
OCP
R2
R1
CTL
Vcc
N.C.
OUT
N.C.
(TO252-5)
GND
(TO220FP-5,-5(V5),HRP5)
Vref
(TO252-5HRP5)
*2
Only for TO252-5 and HRP5
*1 TO252-5 is N.C.,and TO220FP-5,-5(V5),and HRP5 are GND
*1 TO252-3 is N.C.,and TO-220FP-3,is GND
*2
Only for TO252-3 and HRP5
TOP VIEW
TO220FP-3
2
3
TO252-3
1
FIN
2 3
1
(TO220FP-3)
1
2
3
Fin
Vcc
Driver
OVP
TSD
OCP
R2
R1
Vcc
N.C.
OUT
(TO252-3)
GND
Vref
GND
(TO252-3)
TOP VIEW
0.0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
Po
w
e
r
D
issi
pa
ti
o
n
:P
d(
W
)
0
1
2
3
4
5
6
7
8
9
10
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
Po
wer
Di
ss
ip
ati
o
n
:Pd
(W
)
0
5
10
15
20
25
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
Po
wer
Di
ss
ip
ati
o
n
:Pd
(W
)
③7.3W
②5.5W
①2.3W
(1)20.0
(2)2.0
1.30
Board size : 70×70×1.6 ㎜
3 (board contains a thermal via)
Board front copper foil area : 10.5×10.5 ㎜
2
①2-layer board (back surface copper foil area :15×15 ㎜ 2)
②2-layer board (back surface copper foil area :70×70 ㎜ 2)
③4-layer board (back surface copper foil area :70×70 ㎜ 2)
(1)
When using a maximum heat sick : θj-c=6.25(℃/W)
(2)
When using an IC alone : θj-6=62.5(℃/W)
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
相关PDF资料
PDF描述
BA18BC0FP 1.8 V FIXED POSITIVE LDO REGULATOR, PSSO2
BA00BC0WFP 1.5 V-12 V ADJUSTABLE POSITIVE LDO REGULATOR, 0.5 V DROPOUT, PSSO4
BA00BC0WT 1.5 V-12 V ADJUSTABLE POSITIVE LDO REGULATOR, 0.5 V DROPOUT, SFM5
BA18BC0WFP 1.8 V FIXED POSITIVE LDO REGULATOR, 0.5 V DROPOUT, PSSO4
BA18BC0WT-V5 1.8 V FIXED POSITIVE LDO REGULATOR, ZFM5
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