参数资料
| 型号： | BA6406F-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 9/16页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR DVR HALF-WAVE SOP8 TR |
| 标准包装： | 2,500 |
| 应用： | 风扇电机驱动器，2 相 |
| 输出数： | 1 |
| 电流 - 输出： | 70mA |
| 电源电压： | 4 V ~ 28 V |
| 工作温度： | -40°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-SOP |
| 包装： | 带卷 (TR) |
BD6701F
Datasheet
● Power dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta = 25oC (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol θ ja
[ ℃ /W]. The temperature of IC inside the package can be estimated by this heat resistance. Fig.14 shows the model of heat
resistance of the package.
Heat resistance θ ja, ambient temperature Ta, junction temperature Tj, and power consumption P can be calculated by the
equation below:
θ ja = (Tj – Ta) / P [°C/W]
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance
θ ja.
Thermal resistance θ ja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at
a specified condition. Fig.15 shows a thermal derating curve (Value when mounting FR4 glass epoxy board 70 [mm] x 70
[mm] x 1.6 [mm] (copper foil area below 3 [%]))
θ ja = (Tj – Ta) / P [°C/W]
Pd(mW)
800
780
700
624
600
500
Ambient temperature Ta[°C]
Package surface temperature Tc[°C]
400
300
200
100
Chip surface temperature Tj[°C]
0
25
50
75 85 95 100 125
150
Ta( ℃ )
Power consumption P[W]
Fig.14 Thermal resistance
● I/O equivalence circuit(Resistance values are typical)
＊ Reduce by 6.24mW/°C over 25°C
(On 70.0mm x 70.0mm x 1.6mm glass epoxy board)
Fig.15 Thermal de-rating curve
1) Hall input terminal
2)
Output terminal
OUT1
Vcc
OUT2
H+
H-
1k Ω
1k Ω
3)
FG
FG output terminal
4) AL output terminal
AL
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
9/13
TSZ02201-0H1H0B100510-1-2
18.DEC.2012 Rev.002
相关PDF资料 |
PDF描述 |
|---|---|
| BA6423AF-E2 | IC FAN MOTOR DRIVER 1A SOP8 TR |
| BA6424AFS-E2 | IC FAN MOTOR DVR 1A SSOP-A16 TR |
| BA6951FS-E2 | IC DVR REVERSE MOTOR 16SSOP |
| BA78M10FP-E2 | IC REG LDO 10V .5A TO-252-3 |
| BA9743AFV-E2 | IC REG CTRLR BST INV PWM SSOPB16 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BA6407 | 制造商:ROHM 制造商全称:Rohm 功能描述:2-phase half-wave motor driver |
| BA6407AF | 制造商:ROHM 制造商全称:Rohm 功能描述:2-phase half-wave motor driver |
| BA6407AF-E2 | 功能描述:IC MOTOR DVR HALF-WAVE SOP8 TR RoHS:是 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 产品变化通告:ATA683(3,4)PLQW Obsolescence 09/Aug/2012 标准包装:1 系列:- 应用:DC 电机控制器，无刷（BLDC），3 相 评估套件:可供 输出数:1 电流 - 输出:100mA 电压 - 负载:5.25 V ~ 20 V 电源电压:5.25 V ~ 20 V 工作温度:-40°C ~ 150°C 安装类型:表面贴装 封装/外壳:48-VFQFN 裸露焊盘 供应商设备封装:48-VQFN（7x7） 包装:剪切带 (CT) 其它名称:ATA6833-PLQWCT |
| BA6408FS | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Industrial Control IC |
| BA6409F | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Industrial Control IC |
发布紧急采购，3分钟左右您将得到回复。