参数资料
型号: BAS16LD,315
厂商: NXP Semiconductors
文件页数: 5/11页
文件大小: 248K
描述: DIODE SW 100V SOD-882D
标准包装: 1
二极管类型: 标准
电压 - (Vr)(最大): 100V
电流 - 平均整流 (Io): 215mA(DC)
电压 - 在 If 时为正向 (Vf)(最大): 1.25V @ 150mA
速度: 快速恢复 =< 500 ns,> 200mA(Io)
反向恢复时间(trr): 4ns
电流 - 在 Vr 时反向漏电: 500nA @ 80V
电容@ Vr, F: 1.5pF @ 0V,1MHz
安装类型: 表面贴装
封装/外壳: SOD-882D
供应商设备封装: SOD882D
包装: 标准包装
其它名称: 568-5294-6
BAS16LD All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 12 October 2010 3 of 11
NXP Semiconductors
BAS16LD
Single high-speed switching diode
5. Limiting values
[1] Device mounted on an FR4 PCB with 60
μm copper strip line.
[2] Tj
=25°C prior to surge.
[3] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB with 60
μm copper strip line.
[2] Reflow soldering is the only recommended soldering method.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-100V
VR
reverse voltage - 100 V
IF
forward current
[1]
215 mA
IFRM
repetitive peak forward
current
tp
0.5
μs;
δ≤0.25
-500mA
IFSM
non-repetitive peak forward
square wave
current
[2]
tp
=1μs-4A
tp
=1ms - 1 A
tp
=1s - 0.5 A
Ptot
total power dissipation Tamb
25
°C
[1][3]
-250mW
Tj
junction temperature - 150
°C
Tamb
ambient temperature
?55 +150
°C
Tstg
storage temperature
?65 +150
°C
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 500 K/W
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