参数资料
型号: BCD384F480T325A00
厂商: Vicor Corporation
文件页数: 11/18页
文件大小: 0K
描述: EVALUATION BOARD BCM BUS CONVERT
产品培训模块: VI Chip Bus Converter Modules
标准包装: 1
系列: V-I Chip™, BCM™
主要目的: DC/DC,步降
输出及类型: 1,隔离
功率 - 输出: 325W
输出电压: 48V
电流 - 输出: 7A
输入电压: 360 ~ 400V
稳压器拓扑结构: 降压
频率 - 开关: 1.75MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: BCM384F480T325
其它名称: 1102-1009
PRELIMINARY DATASHEET
2.3 RECOMMENDED HEAT SINK PUSH PIN LOCATION
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES:
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
BCM 384 x 480 T 325A00
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V?I CHIP? MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V?ICHIP PRODUCTS.
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Rev. 1.9
V?I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
4/2011
Page 11 of 18
v i c o r p o w e r. c o m
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