参数资料
型号: BCD384F480T325A00
厂商: Vicor Corporation
文件页数: 8/18页
文件大小: 0K
描述: EVALUATION BOARD BCM BUS CONVERT
产品培训模块: VI Chip Bus Converter Modules
标准包装: 1
系列: V-I Chip™, BCM™
主要目的: DC/DC,步降
输出及类型: 1,隔离
功率 - 输出: 325W
输出电压: 48V
电流 - 输出: 7A
输入电压: 360 ~ 400V
稳压器拓扑结构: 降压
频率 - 开关: 1.75MHz
板类型: 完全填充
已供物品:
已用 IC / 零件: BCM384F480T325
其它名称: 1102-1009
PRELIMINARY DATASHEET
BCM 384 x 480 T 325A00
Safe Operating Area
600
500
400
300
200
100
0
43.85
44.85
45.85
46.85
47.85
48.85
49.85
50.85
Output Voltage (V)
Steady State
5mS 325W Ave
Figure 13 — PC disable waveform, 384 V IN , 100 μF C OUT full load
Figure 14 — Safe Operating Area vs. V OUT
2.0 PACKAGE/MECHANICAL SPECIFICATIONS
All specifications are at T J = 25oC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
Length
Width
Height
Volume
Footprint
Power density
SYMBOL
L
W
H
Vol
F
P D
CONDITIONS / NOTES
No heat sink
No heat sink
No heat sink
MIN
32.4 / 1.27
21.7 / 0.85
6.48 / 0.255
TYP
32.5 / 1.28
22.0 / 0.87
6.73 / 0.265
4.81 / 0.295
7.3 / 1.1
1100
68
MAX
32.6 / 1.29
22.3 / 0.89
6.98 / 0.275
UNIT
mm/in
mm/in
mm/in
cm 3 /in 3
cm 2 /in 2
W/in 3
W/cm 3
Weight
W
0.5/14
oz/g
Nickel (0.51-2.03 μm)
Lead finish
Palladium (0.02-0.15 μm)
Gold (0.003-0.05 μm)
μm
Operating temperature
Storage temperature
Thermal capacity
T J
T ST
-40
-40
9
125
125
°C
°C
Ws/°C
Peak compressive force
applied to case (Z-axis)
No J-lead support
5
6
lbs
ESD rating
Peak temperature during re?ow
ESD HBM
ESD MM
Human Body Model
Machine Model [b]
MSL 5
MSL 6
[a]
1500
400
225
245
V DC
°C
°C
Peak time above 183°C
150
s
Peak heating rate during reflow
Peak cooling rate post reflow
1.5
1.5
3
6
°C/s
°C/s
Thermal impedance
? JC
Min board heat sinking
1.1
1.5
°CW
[a]
[b]
JEDEC JESD 22-A114C.01
JEDED JESD 22-A115-A
Rev. 1.9
V?I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
4/2011
Page 8 of 18
v i c o r p o w e r. c o m
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